Intel CEO Pat Gelsinger made his first trip to China since taking office in early 2021. During the trip, Gelsinger attended Intel's sustainability summit in Beijing and met with China's...
Intel has announced delivery of the first multi-chip package (MCP) prototypes created under the state-of-the-art heterogeneous integrated packaging (SHIP) program.
Intel Foundry Services (IFS) has secured orders for fabricating chips on its Intel 3 process node from a major "cloud edge and data center solutions provider," said company CEO Pat...
Intel CEO Pat Gelsinger expressed at the DAVOS Forum on the 17th of this month (January 2023) that he hopes the global chip market will reduce its dependence on Taiwan.
Intel CEO Pat Gelsinger will come to Taiwan before traveling to South Korea to meet the company's local partners, mainly those engaged in the PC and server industry supply chains,...
Intel CEO Pat Gelsinger has made a short visit to Taiwan and met with TSMC in an effort to secure not only sub-7nm process manufacturing capacity but also additional 28nm and other...
