Following Nvidia CEO Jensen Huang's recent visit to Taiwan, Intel CEO Pat Gelsinger will visit the country for the second time in six months, according to sources familiar with the...
During a Q&A session with the press at Intel Innovation 2023, Intel CEO Pat Gelsinger discussed the company's current focus and strategy in light of intensifying competition among...
With Intel splitting its manufacturing and design divisions, competitors such as AMD and Nvidia are already considered as potential Intel customers, said Intel CEO Pat Gelsinger during...
At the ongoing Intel Innovation 2023 conference, Intel CEO Pat Gelsinger announced a number of the company's important AI progress initiatives, including the upcoming launch of its...
Intel CEO Pat Gelsinger has said at a recent earnings call conference that AI PC will serve as a crucial inflection point for the PC market over the coming years that will rival the...
Despite Intel's keen moves in promoting its latest AI solution, the Gaudi 2, in China recently, many Chinese AI companies are reportedly hesitant to switch their AI models onto Intel's...
It appears that Intel strategically announced the launch of its customized AI processor, Habana Gaudi 2, for the Chinese market at a press conference held July 11 in Beijing, shortly...
Intel has chosen a location near Wrocaw, Poland, for a new semiconductor assembly and testing facility, according to the company. This facility will help the company satisfy a crucial...
Intel CEO Pat Gelsinger is in Taiwan for the Intel Vision event, which is aimed at high-level executives and managers from customers and ecosystem partners. In a Q&A with the...
Nvidia, which has long been keen on boosting GPU's computing power, is now being presented with an excellent opportunity from the AI wave, according to Intel CEO Pat Gelsinger.
Intel CEO Pat Gelsinger recently embarked on a visit to South Korea and held a meeting with TM Roh, the head of Samsung Electronics' Mobile Experience (MX) Division, to discuss cooperation...
Intel CEO Pat Gelsinger made his first trip to China since taking office in early 2021. During the trip, Gelsinger attended Intel's sustainability summit in Beijing and met with China's...
Intel has announced delivery of the first multi-chip package (MCP) prototypes created under the state-of-the-art heterogeneous integrated packaging (SHIP) program.
