Server ODMs demonstrated strong performance in the fourth quarter of 2024, driven by general purpose (GP) servers filling the gap as AI servers undergo a transitional period. ODMs...
Continuing advances in AI technologies are driving a rapid expansion of AI applications into areas such as smart factories and smart cities. Coupled with the widespread popularity...
AmTRAN Technology, Taiwan's leading TV and monitor maker, has experienced a surge in orders from US and South Korean customers, fueled by major sporting events and early operations...
Taiwan's AI data center operator Zettabyte has announced that Pegatron will integrate Zware, its self-developed GPU software solution, to boost AI server performance and set a new...
The rapid growth of generative AI (GenAI) and its proliferating applications is driving the need for telecom operators to optimize and expand their 5G systems. According to Ericsson's...
EV charging specialist Zerova, a subsidiary of power supply maker Phihong Technology, expects performance in 2024 to remain roughly on par with 2023, but is eyeing a 20% increase...
Hewlett Packard Enterprise (HPE) surpassed revenue and operating margin expectations in its latest quarter, driven by strong AI-server demand, though margin pressures raise questions...
Foxconn reported a November revenue of NT$672.585 billion (approx. US$20.76 billion), surpassing the total earnings of the previous year in the first 11 months of 2024. Despite a...
AWS announced significant cloud developments and custom chip design progress at its major conference in the US this week. The company's next-generation 3nm chip, Trainium 3, is set...
Intel CEO Pat Gelsinger announced his retirement today, though sources indicate the board presented him with an ultimatum to either resign or face termination. This development adds...
Amazon Web Services (AWS) has unveiled its latest innovation, the Trainium3 chip, featuring an advanced 3nm manufacturing process and scheduled for release in late 2025. The announcement...
Leading AI companies like OpenAI, Anthropic, and Google are encountering significant challenges in developing their next-generation AI models. Progress has fallen short of expectations,...
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
Rugged embedded computer brand – Cincoze has launched two new series of GPU-embedded computers that overcome harsh environmental challenges, meet various application requirements,...
