Taiwan-based cooling solution provider Jentech Precision Industrial is optimistic about its operation in the second half of 2022 as demand from datacenter servers, and electric vehicles...
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Cloud service providers will depend less on processor vendors as more of them are looking to develop their own Arm-based processors, according to sources in the notebook industry...
TSMC and other chipmakers have seen no cutback in orders for datacenter applications, despite market concerns raised recently about Meta Platforms' and Google's potential capex cuts,...
Taiwan-based IC test interface specialists including Chunghwa Precision Test Tech (CHPT) and WinWay Technology are all poised to embrace strong demand for custom accelerator chips...
Kurt Sievers, president and CEO of NXP Semiconductors, said during his keynote at Computex 2022 that the company is about to complete the development of its new-generation automotive...
Taiwan-based IC design houses particularly LCD driver IC firms continue to see their China-based handset clients decelerate their pace of orders, bracing for a potential cutback in...
Samsung Electronics is reportedly mulling developing a new application processor series exclusively for its flagship smartphones, while having its existing Exynos chip series power...
In 1984, Intel decided to exit the DRAM business, which marked the start of technology diversion between memories and logic IC. In hindsight, Intel's decision made sense. Memories...
AMD is expected to roll out its new-generation processors built using TSMC's 5nm process technology as early as September, according to industry sources.
BYD and Horizon Robotics recently announced a partnership involving Horizon's latest high-performance processor Journey 5 for autonomous driving. BYD said it will utilize the car...
Xiaomi, Oppo, Bitmain Technologies, and AI processor startup Horizon Robotics are all eyeing close partnerships with TSMC to satisfy their growing demand, particularly that for sub-5nm...
Apple will no longer be the exclusive customer of TSMC adopting the foundry's advanced integrated fan-out (InFO) wafer-level packaging, which is expected to attract orders for Android...
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
