The need for memory solutions in embedded systems is rapidly increasing, in line with the surging growth of Internet of Things (IoT), artificial intelligence (AI), and 5G-enabled...
Tests of 5G smartphone downlink speed in the US and UK by Ookla show that smartphones using the 5G millimeter wave bands, on average, achieve blazingly fast downlink speeds 20 times...
Dialog Semiconductor has announced that its EcoXiP octal xSPI non-volatile memory (NVM), which was added to Dialog's portfolio through its recent acquisition of Adesto Technologies,...
DRAM and NAND flash are expected to repeat as the two largest IC segments again in 2020 after holding the same positions in 2019, according to IC Insights.
TSMC internally does not consider orders for Intel's processors as long-term ones, and therefore is unlikely to build additional production capacity for the new contract, according...
Intel achieved record second-quarter revenues with 34% data-centric revenue growth and 7% PC-centric revenue growth on year. These results were driven by strong sales of cloud, notebook,...
AMD has announced new 7nm x86 desktop processors with built-in graphics for consumer and commercial PC markets. The AMD Ryzen 4000 series desktop processors with Radeon Graphics and...
It remains to be seen whether unsatisfactory yield rates at Samsung Electronics' 5nm EUV process may affect the launch of Qualcomm's next-generation flagship 5G mobile chip series,...
Imec and Globalfoundries (GF) have jointly announced a hardware demonstration of a new artificial intelligence chip. Based on Imec's analog in memory computing (AiMC) architecture...
As demand for locally-developed CPUs and GPUs in China continues rising amid the US trade sanctions against Chinese IT enterprises, Taiwan-based IC substrate suppliers are expected...
Chinese handset vendor Xiaomi reportedly will work more closely with MediaTek to jointly develop customized SoCs for 5G smartphones after having its Redmi 10X series adopt the chipmaker's...
Backend houses are gearing up for shipments for Microsoft's upcoming Xbox Series game consoles slated to debut at the end of July, and expect shipments for the new consoles to peak...
Intel has launched its first heterogeneous chip architecture made using its Foveros 3D chip stacking technology, while TSMC is looking to commercialize its SoIC (system on integrated...
