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Monday 26 January 2026
Commentary: China's RISC-V progress from C-Sky to T-Head
Alibaba is rumored to be evaluating a plan to spin off T-Head Semiconductor for a potential listing. T-Head may still appear to be a young company, but to the semiconductor industry,...
Monday 26 January 2026
MIPS expands RISC-V processor platform with ARC IP integration

MIPS is repositioning itself within the RISC-V ecosystem following the integration of the ARC Processor IP business acquired from Synopsys,...

Monday 26 January 2026
MIPS accelerates S8200 RISC-V NPU timeline

MIPS has accelerated the development timeline of its S8200 neural processing unit, a RISC-V–based NPU designed for real-time, low-latency...

Monday 26 January 2026
Power transmission efficiency shapes future of AI computing and regional competitiveness
As global investment in generative AI accelerates, the critical bottleneck is shifting from advanced processor manufacturing to the availability and efficiency of power transmission...
Friday 16 January 2026
Xiaomi reportedly skips 2nm for Xring O2, chooses TSMC 3nm to cut costs

Xiaomi's second-generation in-house mobile processor, the Xring O2, will skip TSMC's 2nm process and instead use the company's 3nm N3P...

Thursday 15 January 2026
GlobalFoundries moves into processor IP with ARC acquisition from Synopsys

GlobalFoundries said on January 13 that it has agreed to acquire the ARC Processor IP Solutions business from Synopsys, a move that modestly...

Monday 12 January 2026
CES 2026: Chip giants spread out, visual AI dominates the smaller players
At CES 2026, chipmakers remained at the center of attention. Nvidia CEO Jensen Huang and AMD CEO Lisa Su both delivered keynote speeches, while Lenovo hosted a major event at the Sphere,...
Wednesday 7 January 2026
Nvidia's Vera Rubin enters full production, igniting Micron's HBM4 capacity bet for 2026
When Nvidia CEO Jensen Huang confirmed at CES 2026 that its next-generation AI processor, Vera Rubin, had entered full production, the message to the memory industry was immediate...
Tuesday 6 January 2026
CES 2026: Intel's 18A Panther Lake narrows the gap between iGPUs and discrete graphics
At CES 2026, Intel unveiled its first mobile processor built on the 18A advanced process node, the Core Ultra Series 3, code-named Panther Lake. The launch marks Intel's first large-scale...
Tuesday 6 January 2026
CES 2026: Qualcomm unveils Dragonwing IQ10 robotics processor and general-purpose physical AI stack
Qualcomm Technologies introduced a next-generation robotics architecture at CES 2026, featuring the Dragonwing™ IQ10 Series processor for advanced industrial autonomous mobile...
Tuesday 6 January 2026
CES 2026: Qualcomm unveils Snapdragon X2 Plus platform to power next-generation Copilot+ PCs

Qualcomm unveiled the Snapdragon X2 Plus platform at CES 2026, expanding its Snapdragon X Series lineup for Windows 11 Copilot+ PCs. The...

Thursday 1 January 2026
Samsung reportedly explores side-by-side chip packaging for next-gen Exynos

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,...

Tuesday 30 December 2025
Samsung Electronics supplies Exynos Auto chip to BMW iX3, marking automotive semiconductor push
Samsung Electronics has begun supplying its advanced Exynos Auto V720 processor to BMW's iX3 electric vehicle, signaling the company's formal entry into the automotive semiconductor...
Friday 26 December 2025
Samsung to launch self-developed GPU by 2027, breaking from AMD architecture
Samsung reportedly plans to launch an in-house GPU by 2027, marking a potential shift from reliance on external suppliers. The new GPU will be integrated into the Exynos 2800 mobile...
Tuesday 23 December 2025
EdgeCortix accelerates low-power chip launch to take on Nvidia

Tokyo-based startup EdgeCortix plans to deliver samples of its next-generation Sakura-X artificial intelligence (AI) processor by the end of 2026,...