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Tuesday 19 November 2019
Synergy from acquiring Kemet: Q&A with Yageo chairman Pierre Chen
Taiwan-based Yageo announced recently plans to acquire fellow US-based passive component company Kemet in an all-cash transaction valued at US$1.8 billion. The acquisition is expected...
Wednesday 13 November 2019
Nan Ya set to expand ABF substrate capacity in 2020
Nan Ya PCB has disclosed plans to invest an additional US$48 million in its factory in Kunshan, China, where the Taiwan-based company will expand ABF substrate production capacity...
Friday 2 August 2019
Chipbond posts profit surge in 1H19
LCD driver IC backend specialist Chipbond Technology has reported net profit surged 76.2% from a year earlier to NT$1.98 billion (US$63.2 million) in the first half of 2019. EPS for...
Thursday 13 June 2019
JMC finds strength to compete with bigger rivals
Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...
Monday 13 May 2019
Samsung enters AiP module production for 5G mmWave
Qualcomm has introduced the world's first 5G NR mmWave antenna modules and sub-6 GHz RF modules for smartphones and other mobile devices, but Samsung is fast catching up.
Tuesday 19 March 2019
COF substrate prices to rise 8-15% in 2Q19
COF substrate makers plan to adjust upward quotes for the second quarter by 8-15% sequentially to reflect their tight supplies, according to market sources.
Thursday 1 November 2018
Chipbond posts record 3Q18 profit
LCD driver IC backend specialist Chipbond Technology has reported net profits climbed to a record high of NT$2.71 billion (US$87.6 million) in the third quarter of 2018. EPS for the...
Monday 29 October 2018
Samsung developing FOPLP for wearable devices
Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...
Wednesday 19 September 2018
Yageo buys back shares for NT$2.42 billion
Yageo has repurchased around NT$2.42 billion (US$178.6 million) worth of its common shares from the open market, at average price per share of NT$816.71, according to a company filing...
Friday 26 January 2018
Toray to expand MLCC materials production capacity, says report
Japan-based Toray will invest a total of JPY1.1 billion (US$10 million) in building additional production capacity of release films for MLCC materials, according to a Taiwan-based...
Friday 22 December 2017
Taiwan makers urged to develop more niche MLCCs
Though lower-tier commodity MLCCs have become a seller's market due to lingering supply shortfall, Taiwan makers must step up the development of niche-type MLCCs if they want to tap...
Tuesday 22 August 2017
China PCB firms step up capacity expansion
China-based PCB manufacturers including Suzhou Dongshan Precision Manufacturing (DSBJ) and Jiangxi Holitech Technology have moved to expand their production capacities eyeing a bigger...
Thursday 27 November 2014
Samsung Electro-Mechanics to expand businesses in China in 2015, says paper
The Samsung Group's component manufacturing affiliate Samsung Electro-Mechanics has seen its performance seriously impacted by Samsung Electronics' weakening smartphone sales recently...
Wednesday 19 November 2014
Samsung Electro-Mechanics looking to form deeper connection with China market
Samsung Electro-Mechanics, a component affiliate of the Samsung Group, is looking to have deeper communication and interaction with the China market as demand from the country is...
Tuesday 27 July 2010
Taiwan PCB makers see little threat from SEMCO Kunshan plant
Samsung Electro-Mechanics (SEMCO) has recently kicked off volume production at its PCB plant in Kunshan, eastern China, raising concerns that the Korea-based company may pose a threat...