Foxconn Technology Group is likely to kick off construction of a 12-inch wafer fab in 2020 in Zhuhai, southern China in cooperation with the city government there, and will operate...

BOE Technology Group has successfully developed in-display optical fingerprint sensing solution for LCD screen, and will start volume production of LCD panels embedded with the optical...

Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...

Sensor component specialist Sensortek Technology, in which Sitronix Technology holds a 50.44% stake, started trading on Taiwan's emerging stock market on June 18.

IC design houses Novatek Microelectronics and Realtek Semiconductor both saw their May revenues climb to respective record-high levels, thanks to shipments of their new products.

Niche-market IC packaging house Xintec continues to expand its offerings and client portfolio in its target markets, and remains focused on wafer-level packaging, according to company...

Touch module supplier General Interface Solution (GIS) plans to ramp up sharply its production capacity for in-display ultrasonic fingerprint sensor modules in the second half of...

Asustek Computer has teamed up with Industrial Technology Research Institute (ITRI) to develop artificial intelligence (AI) for Internet of Things (AIoT) technologies.

Himax Technologies has introduced its ultra-low power, AI-based visual sensor for notebooks, with the solution already certified by Quanta Computer.

Taiwan's CMOS image sensor (CIS) packaging specialist Kingpak Technology is expected to see its second-quarter revenues fall only slightly on quarter as its average capacity utilization...

GaAs epi-wafer company Intelligent Epitaxy Technology (IntelliEPI), which uses MBE (molecular beam epitaxy) growth technology, saw its revenues for April plunge 23.8% on month to...

LCD driver IC design specialist Novatek Microelectronics expects shipments of its high-ASP and high-margin TDDI (touch and display driver integration) chips to top 20 million units...

Taiwan-based IC design houses have seen orders for Android smartphones pick up in the second quarter, thanks mainly to the upcoming rollouts of new models, according to industry so...

Backend house King Yuan Electronics (KYEC) reportedly will team up with Qualcomm to set up an engineering test center to be installed with 20-30 sets of equipment for testing 5G radio-frequency...

GEM Services, which specializes in packaging semiconductor power devices, and CMOS image sensor backend specialist Kingpak Technology both saw their revenues for the first quarter...