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Wednesday 18 May 2022
Kingray obtains certification for near-IR NBPF used in ToF 3D-sensing modules
Kingray Technology, a company engaged in cutting and coating processing of optical filters, has disclosed it has obtained certification form a US-based maker of ToF (time of flight)...
Tuesday 17 May 2022
WeavAir looking for specialized sensory chips suppliers for fully automated air-monitoring solution
Aware of the air quality and the impact of exhaust emissions since her days studying Ph.D., Natalia Mykhaylova and her team at WeavAir created an analytics tool to help clients in...
Friday 13 May 2022
Sensor vendor PixArt expects sales growth in 2Q22
Image sensor specialist PixArt Imaging expects to post a 10-15% sequential revenue growth in the second quarter, after seeing its sales slip 15.2% sequentially in the first quarter...
Tuesday 10 May 2022
AI applications key to realizing autonomous driving
Autonomous driving and intelligent cockpit are two key application areas of artificial intelligence (AI), which can be used to transform camera and sensor data into actionable info...
Thursday 28 April 2022
GIS to ramp up capacitive fingerprint sensor output at new plant in 2H22
Touch display solution provider General Interface Solution (GIS) will have its new plant in Taichung, central Taiwan, come online mainly for producing capacitive fingerprint recognition...
Wednesday 27 April 2022
DDI maker FocalTech remains optimistic about 2022 shipments
Taiwan-based FocalTech Systems, a supplier of touchscreen and LCD driver ICs (DDIs), has reiterated its optimistic outlook for overall shipments this year, despite sluggish handset...
Thursday 21 April 2022
ASE to complete Chungli factory site expansion in 3Q24
ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...
Thursday 24 March 2022
Egis focuses on notebook sensor ICs for 2022 growth
Egis Technology hopes fingerprint sensor and dToF (direct time-of-flight) ICs used in notebooks and optical sensor ICs used in TWS devices can drive business growth in 2022, according...
Wednesday 16 March 2022
PMIC supply to stay tight in years to come
The supply of power management ICs, particularly those demanding 8-inch wafer fab capacities, will remain constrained over the next several years, despite international IDMs keenly...
Wednesday 16 March 2022
COVID spike in China disrupting handset CIS shipments, sources say
A spike in COVID-19 cases in Hong Kong and other Chinese cities is disrupting handset CMOS image sensor (CIS) shipments, as well as deliveries of related modules and other devices,...
Wednesday 23 February 2022
Unimicron to merge with SiP substrate specialist
Unimicron Technology has announced plans to merge with Subtron Technology, which specializes in SiP substrates, looking to integrate resources to expand product portfolios and seize...
Friday 18 February 2022
Xintec cautious about 2022
CMOS image sensor backend specialist Xintec has expressed caution about its sales performance this year, citing the ongoing pandemic, labor shortages, and supply-side challenges,...
Wednesday 16 February 2022
Sensor vendor PixArt sees sales pick up starting March
Image sensor specialist PixArt Imaging expects its revenues to start picking up in March, as inventory adjustments at customers are about to come to an end, according to industry...
Tuesday 15 February 2022
KYEC reiterates sales outlook for 1Q22
IC testing house King Yuan Electronics (KYEC) has reiterated its revenue guidance for the first quarter of 2022 despite local COVID outbreaks at its production subsidiary in Suzhou,...
Tuesday 15 February 2022
Semiconductor sales to rise at 7% CAGR through 2026, says IC Insights
Total semiconductor sales are forecast to rise 11% in 2022, following a 25% surge in 2021 and an 11% increase in 2020, according to the market research group IC Insights. If achieved,...
Wednesday 15 August 2018
Samsung OLC SSD
Samsung Electronics has begun mass producing the industry's first 4-bit (QLC, quad-level cell) 4-terabyte (TB) SATA solid-state drive (SSD) for consumers. Based on 1-terabit (Tb) V-NAND with performance equivalent to the company's 3-bit design, Samsung's QLC SSD is expected to bring a new level of efficiency to consumer SSDs, Samsung said. With its new 1Tb 4-bit V-NAND chip, Samsung will be able to efficiently produce a 128GB memory card for smartphones that will lead the charge toward higher capacities for high-performance memory storage. Typically, as data stored within a memory cell increases from three bits to four, the chip capacity per unit area would rise and the electrical charge (used to determine information from a sensor) would decrease by as much as 50% making it considerably more difficult to maintain a device's desired performance and speed. However, Samsung said its 4-bit 4TB QLC SATA SSD maintains its performance levels at the same level as a 3-bit SSD, by using a 3-bit SSD controller and TurboWrite technology, while increasing drive capacity through the use of 32 chips, all based on 64-layer fourth-generation 1Tb V-NAND. The 4-bit QLC SSD enables a sequential read speed of 540 MB/s and a sequential write speed of 520 MB/s, and comes with a three-year warranty. Samsung plans to introduce several 4-bit consumer SSDs later in 2018 with 1TB, 2TB, and 4TB capacities in the widely used 2.5-inch form factor.
Monday 23 January 2017
Asustek ZenFone 3 Zoom smartphone
Asustek Computer has announced ZenFone 3 Zoom, an ultra-thin 5.5-inch smartphone with a 5000mAh battery and a dual-camera system. The ZenFone 3 Zoom features dual-camera system consists of a main camera with an f/1.7-aperture, 25mm wide-angle main lens paired to a 12-megapixel Sony IMX362 sensor with large 1.4µm pixels (1/2.55in sensor size); and a 59mm, 12-megapixel zoom camera with an instant 2.3X optical zoom and a 12X total zoom. This setup ensures sharp focus for subjects at any distance, the vendor said. ZenFone 3 Zoom also has the first Asustek SuperPixel Camera that enables shooting in night-time or low-light environments. The smartphone is equipped with Qualcomm's Snapdragon 625 14nm processor, while the high-capacity battery also gives the ZenFone 3 Zoom the ability to double up as a power bank to charge other devices.
Tuesday 22 March 2016
Samsung 12-megapixel image sensor
Samsung Electronics has announced a 12-megapixel image sensor for smartphones. Already in mass production, this 1.4 micron-pixel-based image sensor is equipped with Dual Pixel technology that has been reserved for DSLR cameras. Samsung's new image sensor with Dual Pixel technology employs two photodiodes located on the left and right halves of a pixel, while a conventional image sensor dedicates less than 5% of its pixels, with one photodiode each that converts light particles into measurable photocurrent for phase detection. As each and every pixel of the Dual Pixel image sensor is capable of detecting phase differences of perceived light, significantly faster auto-focus has become possible. The image sensor has also adopted Samsung's ISOCELL technology, which isolates the photodiodes in each pixel with a physical wall to further reduce color cross talk, maximizing the image sensor's performance. For top-of-the-line performance while keeping the size to a minimum, the new image sensor is built with cutting-edge chip-stacking technology. The Dual Pixel image sensor stacks a 65nm sensor and 28nm logic chip together to deliver outstanding photo-taking experiences in today's sleek smartphones.
AROUND THE WEB
SK Hynix begins volume production of 0.7-micron image sensors
Wednesday 26 January 2022
May 18, 11:03
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Monday 9 May 2022
HOLTEK launches new 32-bit touch key MCUs – Provides professional technology services and solutions
Tuesday 3 May 2022
Chenbro wins 2022 iF Design Award for high-density storage server chassis
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Vedanta looking for chip customers in advance
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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