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Thursday 23 June 2011
SPIL turning focus to SiP packaging, IDM orders
Siliconware Precision Industries (SPIL) is stepping up the development of system-in-package (SiP) specifically for use in handsets, and has been more actively expanding its IDM client...
Monday 13 June 2011
ChipSiP creates a fun and smart lifestyle by core miniature-force of SiP
ChipSiP Technology, the leading company in turnkey SiP solutions, features "Smart, Share, Smile" at Computex Taipei 2011. SiP technology has been merging into daily life...
Wednesday 4 May 2011
AzureWave debuts on TSE
Taiwan-based wireless module maker AzureWave Technologies on May 3 debuted its shares on the Taiwan Stock Exchange (TSE), opening at NT$35 (US$1.22) and closing at NT$35.70.
Tuesday 19 April 2011
AcSiP expects huge growth in 2011 shipments of SiP modules
AcSiP Technology, which makes wireless communication SiP (system in package) modules for use in handsets and e-book readers, expects to ship 10-15 million units in 2011, up from 2.6...
Tuesday 15 June 2010
ChipSiP partners with Zoran for PoP packaging
Taiwan-based SiP solution provider ChipSiP Technology and Zoran have announced that they have collaborated to produce a new slim package solution for the compact digital camera market...
Friday 4 June 2010
ChipSiP Technology to begin volume production of RF SiP products in 3Q10
ChipSiP Technology, a Taiwan-based SiP (system-in-package) solution provider, has come out with a series of RF SiP (antennas on chip) solutions for increasing applications in smartphones,...
Friday 7 May 2010
PTI sees MCP, SiP contributions grow in 1Q10 revenues
Memory backend supplier Powertech Technology (PTI) managed to push the revenue ratios of its non-memory MCP (multi-chip package) and SiP (system-in-package) services to 11% and 9%,...
Thursday 28 January 2010
AcSiP Technology to ramp Wi-Fi SiP module output in 1Q10
AcSiP Technology, a SiP module subsidiary of NAND flash device backend service company Aptos Technology, is expected to ramp up its output of Wi-Fi SiP modules for handsets to 300,000...
Wednesday 27 January 2010
PTI targets top-4 spot in global IC backend market
Powertech Technology (PTI) aims to become the number-four IC packaging and testing house worldwide in three years, chairman DK Tsai said at the company's annual banquet on January...
Wednesday 18 November 2009
ASE to buy up shares in USI, targeting SiP applications
Advanced Semiconductor Engineering (ASE) is seeking to acquire all of the outstanding shares of Universal Scientific Industrial (USI) for NT$21 (US$0.65) per share, with the total...
Friday 2 October 2009
3D IC packaging to be mature within 3 years, says ASE chief officer
Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...
Tuesday 25 August 2009
PTI purchase of Spansion backend facility in China to target non-memory products, say sources
Powertech Technology (PTI) aims to turn the China plant it is buying from Spansion into its major production base for non-memory packaging and testing, covering logic ICs, SiP (system...
Tuesday 28 July 2009
Global Unichip SiP solution validated by TSMC
Global Unichip has announced that its SiP design solution has passed the validation process of Taiwan Semiconductor Manufacturing Company (TSMC).
Tuesday 24 March 2009
Giga Solution and Global Unichip launch RF SiP test solution for mobile TV tuner mass production
Giga Solution, a test service corporation focusing on RFIC/SiP/SoC test area, and Global Unichip, a fabless ASIC and SoC design service provider, have announced the jointly developed...
Monday 12 January 2009
SiP getting popular in Wi-Fi chip packaging, says paper
Atheros Communications, Ralink Technology, Broadcom and Marvell are forging closer relationships with Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries...