ChipSiP Technology, a leading company in turnkey SiP solutions, has achieved total shipments of 100,000 WiDi modules by the first quarter of 2012 after selling bundle with an international...
Taiwan-based wireless SiP (system in package) solution provider AcSiP Technology, viewing that fast increasing shipments of entry- to mid-level smartphones in China will bring about...
ChipSiP Technology Co, Ltd. (Taiwan: 3637), a leading company in turnkey SiP solutions, launched three new products featuring optimum slimness, portability and connectivity for a...
Siliconware Precision Industries (SPIL) is stepping up the development of system-in-package (SiP) specifically for use in handsets, and has been more actively expanding its IDM client...
ChipSiP Technology, the leading company in turnkey SiP solutions, features "Smart, Share, Smile" at Computex Taipei 2011. SiP technology has been merging into daily life...
Taiwan-based wireless module maker AzureWave Technologies on May 3 debuted its shares on the Taiwan Stock Exchange (TSE), opening at NT$35 (US$1.22) and closing at NT$35.70.
AcSiP Technology, which makes wireless communication SiP (system in package) modules for use in handsets and e-book readers, expects to ship 10-15 million units in 2011, up from 2.6...
Taiwan-based SiP solution provider ChipSiP Technology and Zoran have announced that they have collaborated to produce a new slim package solution for the compact digital camera market...
ChipSiP Technology, a Taiwan-based SiP (system-in-package) solution provider, has come out with a series of RF SiP (antennas on chip) solutions for increasing applications in smartphones,...
Memory backend supplier Powertech Technology (PTI) managed to push the revenue ratios of its non-memory MCP (multi-chip package) and SiP (system-in-package) services to 11% and 9%,...
AcSiP Technology, a SiP module subsidiary of NAND flash device backend service company Aptos Technology, is expected to ramp up its output of Wi-Fi SiP modules for handsets to 300,000...
Powertech Technology (PTI) aims to become the number-four IC packaging and testing house worldwide in three years, chairman DK Tsai said at the company's annual banquet on January...
Advanced Semiconductor Engineering (ASE) is seeking to acquire all of the outstanding shares of Universal Scientific Industrial (USI) for NT$21 (US$0.65) per share, with the total...
Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...
Powertech Technology (PTI) aims to turn the China plant it is buying from Spansion into its major production base for non-memory packaging and testing, covering logic ICs, SiP (system...
