Benefiting from its High Bandwidth Memory (HBM) business, SK Hynix has experienced substantial revenue growth and forecasts a doubling of shipments in 2024. Regarding recent concerns...
The world's top-3 memory chipmakers are likely to reduce their NAND flash memory capex in 2024, following two years of robust spending, according to industry sources.
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
Samsung and SK Hynix plan to invest KRW360 trillion (US$259.2 billion) and KRW120 trillion, respectively, to build 10 semiconductor fabs in Yongin, South Korea, making it the world's...
SK Hynix has reported revenue hit an all-time high of KRW16.42 trillion (US$11.8 billion) in the second quarter of 2024, when operating profits topped KRW5 trillion for the first...
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
NAND Flash memory suppliers are gearing up for robust demand driven by AI smartphones in the third quarter. Some sources suggest that production lines may already be experiencing...
As the AI era unfolds, the demand for memory solutions that maximize performance while minimizing power consumption is growing exponentially. Samsung Electronics is reportedly developing...
Instead of building a foundry production line at its P4 facility as previously planned, Samsung Electronics reportedly plans to prioritize building a memory production line, highlighting...
In vying for Nvidia's next-generation memory orders, SK Hynix is prioritizing cost reduction through a more radical approach: eliminating silicon interposers entirely from HBM4 production,...
While SK Hynix, Samsung Electronics, and Micron Technology are locked in an intense technology race for the sixth-generation High Bandwidth Memory (HBM), HBM4, foundry giant TSMC...
Samsung Electronics has nearly doubled its NAND Flash production in the second quarter of 2024 after hitting a low point in the fourth quarter of 2023.
South Korean memory giants Samsung Electronics and SK Hynix, in addition to High Bandwidth Memory (HBM), will also start the competition in smartphone LPDDR DRAM stacking.
Amid the competition among SK Hynix and Samsung Electronics regarding HBMs, SK Hynix reportedly plans to team with Amkor to enter the interposer market to alleviate the interposer...
As the market for Thermo Compression Bonding (TCB) equipment diversifies, Semes, a subsidiary of Samsung Electronics and South Korea's leading semiconductor equipment manufacturer,...
