Taiwan-based remote server management SoC solution provider Aspeed Technology expects to post record profits in 2021 along with its revenues for the year surging 18.7% on year to...
It will take at least six months for Advantest to deliver its high-end SoC testing equipment as shortage of key chip components needed to power the equipment has constrained the company's...
As part of CES 2022, Intel demonstrated advancements and momentum with Mobileye, progress toward discrete graphics leadership and the launch of the newest members of the 12th Gen...
China IC designer Unison has entered volume production of two 5G smartphone SoCs fabricated using 6nm EUV process, dubbed T770 and T760, looking to expand its presence in the 5G handset...
Foundries and IC designers are set to face increasingly volatile market conditions in 2022, as strong demand seen in 2020-2021 is expected to start softening at a slow pace, US-China...
Unisoc has used Imagination Technologies' Series3NX neural network accelerator (NNA) IP in its new smartphone 5G platforms - Tanggula T770 and T760 system-on-chips (SoC), according...
Broadcom and MediaTek are set to release their respective Wi-Fi 7 SoC series in the first half of 2022, looking to build a preemptive presence in the next-generation Wi-Fi segment...
MediaTek will be able to post a 10-20% revenue increase in 2022 although the overall semiconductor market will grow at a slower pace than in 2021, and is bound to launch its first...
Etron Technology's in-house developed KOOLDRAM products are being adopted by car vendors, a milestone for its entry into the automotive sector, according to the Taiwan-based niche-market...
Mobile SoC specialist MediaTek is gearing up for robust demand from its China-based smartphone clients in 2022, as vendors such as Oppo, Transsion and Vivo set aggressive shipment...
Unsatisfactory manufacturing yield rates for Samsung's 4nm process technology are prompting Qualcomm to diversify its foundry sources for high-end Snapdragon SoCs, industry sources...
Taiwan's leading backend house ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have obtained major orders for processing Qualcomm's just-unveiled flagship...
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...
TV-related IC demand is expected to pick up as early as the first quarter of 2022 following a slowdown in TV market sales seen since the third quarter of 2021, according to sources...
