Taiwan-based chipmakers, led by foundry TSMC and silicon wafer supplier GlobalWafers, are gearing up to tap into the market for gallium nitride (GaN), silicon carbide (SiC) and other...
Taiwan-based foundries and IC design houses are looking to expand their presence in the automotive electronics sector, where chip demand is set to grow robustly, according to industry...
STMicroelectronics (ST) recently released its third-quarter financial results. Revenue in 3Q reached US$3.19 billion with a net income of US$474 million. Despite being slightly lower...
Taiwan-based IC design houses, particularly those engaged in consumer ICs, have come under increasing pressure to maintain their quotes for 2022 as customers are more reluctant to...
Automotive IDMs have notified their clients about 10-20% price hikes for their chips starting 2022 as they continue to face mounting costs for raw materials, according to industry...
Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions, worldwide installed capacity for power and compound semiconductor fabs is projected...
China-based OSAT Tongfu Microelectronics plans to raise up to CNY5.5 billion (US$854 million) to fund its upcoming capacity expansions for a variety of segments, according to industry...
STMicroelectronics and Xilinx have both notified their clients about price increases for their chip solutions starting the fourth quarter of 2021, which is expected to fuel a new...
IDMs including TI, Infineon, STMicroelectronics and Microchip have all stepped up their deployments in the market for power devices using GaN, SiC and other third-generation semiconductor...
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...
Taiwan-based leadframe makers Shuen Der Industry (SDI) and Jih Lin Technology are optimistic about shipments for automotive power components and modules over the next two to three...
A nationwide lockdown in Malaysia has made disruptions to the output from local chip plants, which fulfill mainly orders for entry-level and mid-range logic ICs, and power diodes...
China-based CanSemi Technology has raised funds to carry out its upcoming capacity expansion project, in which the specialty IC foundry will add an additional 20,000 12-inch wafers...
