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Friday 14 January 2022
Buima steps into energy storage application
Energy-saving construction material maker Buima has entered the energy storage market through establishing an energy technology team in the second quarter of 2021 and acquiring a...
Thursday 13 January 2022
Micron enters volume shipments of 176-layer QLC NAND SSDs
Micron Technology has begun volume shipments of 176-layer QLC NAND SSDs, according to the company.
Wednesday 12 January 2022
Global server shipment forecast and industry analysis, 2022
Cloud datacenter operators' strong order momentum in 2021 had driven up the sales growth of high-density and multi-node rack servers with higher unit prices, high-speed network communication...
Monday 10 January 2022
Memory module firms post strong sales in 4Q21
Adata Technology and Team Group both saw their revenues hit peak for 2021 in the fourth quarter, while strong fourth-quarter sales boosted fellow memory module company Phison Electronics'...
Thursday 6 January 2022
Phison acquires remaining stake in Nextorage
Phison Electronics has fully acquired Nextorage, in which it already held a 49% stake, for an undisclosed sum, according to the Taiwan-based flash storage controller specialist.
Wednesday 5 January 2022
The only in Taiwan! DEKRA establishes first EMI absorber automatic storage anechoic chamber, improving EMC service
In order to improve service, the global testing certification institution, DEKRA, established Taiwan's first high frequency EMI noise absorber automatic storage anechoic chamber....
Thursday 23 December 2021
Memory demand for data centers and enterprise storage to pick up starting 1Q22
Memory demand for data centers and enterprise storage is expected to see a substantial pick-up at the end of first-quarter 2022, according to market sources.
Thursday 23 December 2021
Chenbro launches innovative RM25324 high density storage server chassis to meet diverse data needs
As enterprises continue to digitize at an even faster pace, global data is also on a slope of substantial growth. According to research from IDC, the total global amount of data will...
Wednesday 22 December 2021
Micron sees AI, 5G and EV drive memory demand growth
Memory and storage revenue has outpaced the rest of the semiconductor industry over the last two decades, according to Sanjay Mehrotra, president and CEO for Micron Technology, who...
Friday 17 December 2021
HDD makers facing uncertainties from chip shortages
Taiwan hard disc drive (HDD) ODMs are facing continued uncertainty around production due to shortages in certain chips and components, though they remain mostly optimistic about their...
Thursday 16 December 2021
Global server shipment forecast, 2022
According to Digitimes Research's statistics and analyses, the 2021 global server market has a supply-demand gap as large cloud service operators step up orders to meet the pandemic-driven...
Monday 13 December 2021
Chenbro launches 2U compact JBOD for high-density storage in big data era
Chenbro (TWSE: 8210), a pioneer in the design and manufacturing of own-brand rackmount system, is excited to announce the latest compact 2U JBOD, the DS25224, which supports 24 x...
Monday 13 December 2021
Taiwan companies eye lithium battery production for EV, energy storage
Taiwan-based supply chains are stepping up to meet lithium battery demands as a result of the rising popularity of electric vehicles (EV) and energy storage systems.
Wednesday 8 December 2021
Buima develops battery module and energy storage applications
Buima Group has invested in Joules Miles to enter into the battery module field. Combined with their building materials foundation, Buima plans to develop a new application category...
Monday 6 December 2021
Memory demand to boom for AI, says Macronix chairman
Memory demand is set to rise further, as AI applications become more widespread, according to Miin Wu, chairman for ROM and flash chipmaker Macronix International.
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.