Unimicron Technology and Kinsus Interconnect Technology, two top ABF substrate manufacturers in Taiwan, were listed 28th and 30th in the Asia IC50 2022 ranking released by DIGITIMES...

Nan Ya PCB is looking to grow its automotive IC substrate sales as a proportion of company revenue to over 10% in 2022, up from 7-8% in 2021, according to company sources.

Samsung Electro-Mechanics (Semco) has announced plans to spend more on its FCBGA packaging substrate production in South Korea and Vietnam.

Unimicron Technology will continue ramping up its ABF substrate capacity till 2025 to cope with increasing demand from the 5G, AIoT, HPC and networking device sectors.

The transition to DDR5 memory in the data center sector will be taking place in 2022, and Micron Technology is gearing up for the robust demand, according to Sumit Sadana, executive...

Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...

System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...

Roshow Technology plans to raise additional funds through a private placement to finance its silicon carbide (SiC) wafer and substrate business.

Ofuna Technology has enjoyed a strong pull-in of orders from ABF substrate suppliers looking to carry out their capacity expansion projects, according to the Taiwan-based company...

ASMedia Technology, an affiliate of Asustek Computer specializing in high-speed transmission chips, has transitioned to 28nm process manufacturing for part of its chip solutions while...

Samsung Electro-Mechanics (Semco) is poised to step into the server package substrate sector with plans to build new production lines for high-end ABF substrates in South Korea and...

AMD is expected to roll out its new-generation processors built using TSMC's 5nm process technology as early as September, according to industry sources.

Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...

TankeBlue Semiconductor, a Beijing-based silicon carbide (SiC) substrate supplier, plans to raise funds through an IPO to enhance its working capital for technology R&D and production...

OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...