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Tuesday 9 March 2010
IC substrate maker Kinsus sees order visibility through May
Kinsus Interconnect Technology has seen its order visibility extend to May 2010, with new orders focusing on bismaleimide triazine (BT)-based flip-chip chip scale packaging (FC CSP)...
Friday 5 March 2010
LCD glass substrates 10% short of total panel demand
Global LCD panel glass substrate supply is currently 10% short of demand, with the shortage hitting 5G production the most, market sources said.
Friday 5 March 2010
LCD panel oversupply gap in 2Q10 to drop to 5% due to quake, say sources
Oversupply of LCD panels in the second quarter is expected to drop to below 5% from the previously estimated 7% over total demand after an earthquake rocked southern Taiwan yesterday,...
Thursday 25 February 2010
IC substrate maker Kinsus expects 2010 capex to reach NT$1.5 billion
IC substrate maker Kinsus Interconnect Technology expects its capex for 2010 to reach NT$1.5 billion (US$46.8 million), up from NT$800 million in 2009. The company also revealed that...
Thursday 28 January 2010
First-tier panel makers to face glass substrate shortage of 10-20% in 1Q10
Taiwan-based first-tier LCD panel makers estimate their glass substrate shortage will reach 10-20% of their total demand in the first quarter of 2010 due to glass substrate suppliers'...
Wednesday 20 January 2010
IC substrate maker Kinsus sees growing demand from handset segment
Kinsus Interconnect Technology expects first-quarter revenues to have only a slight drop sequentially despite fewer working days, as demand from handset chip customers has picked...
Wednesday 13 January 2010
TUC to see rising shipment ratio of halogen-free CCLs in 2010
Taiwan Union Technology (TUC) will see halogen-free copper-clad laminates (CCLs) account for more than 15% of its total CCL shipments later in 2010 from 12% in the second half of...
Tuesday 5 January 2010
Holy Stone steps into US solar module market
Passive component maker Holy Stone has begun small-volume shipments of ceramic heat sink substrates and reportedly entered the supply chain of an US-based solar module maker. The...
Tuesday 5 January 2010
IC substrate maker NPC beats December revenue guidance
Nanya Printed Circuit Board (NPC) has reported revenues of NT$2.7 billion (US$84.99 million) for December 2009, slightly better than its estimated NT$2.5-2.6 billion. The IC substrate...
Thursday 24 December 2009
Irico to establish 6 glass substrate production lines in China
China-based TFT-LCD panel maker Irico Group Electronics will invest 3.7 billion yuan (US$541.8 million) to establish six glass substrate production lines in Hefei City, China, including...
Tuesday 22 December 2009
PCB makers to enjoy strong sales growth of LED heat sink substrates in 2010
Taiwan-based PCB makers, including Chin-Poon Industrial, Iteq, Taiflex Scientific, and Gia Tzoong Enterprise, are expected to enjoy sales contributions from aluminum heat sink substrates...
Wednesday 16 December 2009
Acme to double sapphire substrate capacity in 2010 on increasing LED demand
Taiwan-based inductor maker Acme Electronics plans to double capacity of its sapphire crystal substrates in 2010 to satisfy increasing LED demand. The company is seeing its sapphire...
Friday 4 December 2009
NPC sees on-month drop in November 2009 revenues
Nan Ya Printed Circuit Board (NPC) has announced revenues of NT$2.65 billion (US$82.36 million) for November 2009, down slightly by 1.37% on month. The company expects its December...
Wednesday 2 December 2009
Chipbond eyes outsourcing COF substrate orders from Mitsui subsidiary
Chipbond Technology has disclosed it is negotiating an outsourcing deal with MCS, a subsidiary of Japan-based Mitsui Kinzoku. Both parties have been evaluating the possibility of...
Wednesday 18 November 2009
Chip resistor substrate ASP will remain stable
Chip resistor substrate ASPs will not see large fluctuations as demand remains high, according to market sources. Alumina substrate supplier Leatec Fine Ceramics has resumed all of...