Zhen Ding Technology, Compeq Manufacturing and Unimicron Technology, suppliers of substrate-like PCBs for Apple's iPhone 12, and Elite Material (EMC), which provides related SLP CCL...
Taiwan's Unimicron Technology reportedly is the sole supplier of ABF substrates for Apple-designed M1 chipsets powering its just-unveiled new MacBook series.
A new wave of price hikes for high-end IC substrates, ranging from 20-40%, has emerged following a recent fire damaging a plant of Taiwan's Unimicron Technology, with clients rushing...
Unimicron Technology's IC substrate plant in Taoyuan, northern Taiwan caught fire on the afternoon of October 28. The site is where the company produces flip-chip chip-scale packaging...
A sound ecosystem for high-end IC substrates has to be built in Taiwan as such substrates will still have a big role to play in backend services despite the growing demand for substrate-free...
Taiwan-based equipment makers including Csun Manufacturing and Gallant Precision Machining (GPM) expect strong demand from domestic IC substrates makers now all gearing up to build...
Taiwan's PCB makers Compeq Manufacturing and Unimicron, both now supplying SLP mainboards for iPhone 12 mini and iPhone 12 Pro Max, are likely to land additional orders from Apple...
TSMC as a top-choice foundry partner for HPC (high performance computing) chips vendors will significantly benefit Taiwan suppliers of ABF substrates for processing such chips, according...
Zhen Ding Technology, Compeq Manufacturing and Unimicron Technology have together landed nearly 60% of total substrate-like PCB (SLP) orders placed by Apple for its new iPhone 12...
PCB and IC substrate maker Unimicron Technology has expressed caution about its performance in the fourth quarter of 2020, despite a pick-up in demand for handsets.
Taiwan's PCB equipment makers including C Sun and Symtek Automation Asia are poised to embrace strong growth momentum as many PCB and IC substrate makers are keenly expanding capacities...
Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are being discouraged from making further investments in China by the...
Both Intel and AMD reportedly have resumed shipments to Huawei after obtaining export permits from US authorities, but Taiwan's IC substrates do not expect their revenues to receive...
ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...
Taiwan-based Unimicron, Nan Ya PCB and Kinsus Interconnect Technology have seen their ABF substrate capacities fully booked throughout the first half of 2021 thanks to strong demand...
