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NEWS TAGGED UNIMICRON
Friday 18 September 2020
Chinese handset vendors scaling up orders for anylayer HDI boards
Non-Huawei Chinese handset vendors are significantly scaling up orders with Taiwanese makers of HDI boards for midrange and high-tier handsets, seeking to snatch more market shares...
Thursday 17 September 2020
Taiwan makers to supply all SiP substrates for new Apple Watch
SiP substrates adopted for processing core processors and peripheral components for new Apple Watch models reportedly will be all supplied by three Taiwanese makers, Unimicron Technology,...
Tuesday 15 September 2020
ABF substrate supply to stay tight despite no shipments for Huawei
Taiwan-based IC substrate makers including Unimicon Technology, Nan Ya PCB and Kinsus Interconnect Technology continue to see their available production capacities for ABF substrates...
Tuesday 15 September 2020
Unimicron resuming seasonal shipment momentum in September
Unimicron Technology, after seeing its August revenues decrease 2.1% sequentially and 6.13% on year to NT$7.48 billion (US$255.29 million), has resumed peak-season shipment momentum...
Wednesday 9 September 2020
Suppliers gearing up for SiP demand boom
TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...
Tuesday 8 September 2020
Fire breaks out at Unimicron China plant
A fire broke out at Unimicron Technology's factory in Kunshan, China on September 7, with details of the losses still being evaluated and cause of the fire under police investigation,...
Monday 7 September 2020
SLP board suppliers ramping up shipments for next-generation iPhone lineup
Suppliers of SLP (substrate-like PCB) boards for the next-generation iPhone devices (tentatively named iPhone 12) have been ramping up shipments of related products since July-August,...
Thursday 27 August 2020
Taiwan makers poised to scale up AiP substrate shipments in 2021
Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...
Wednesday 26 August 2020
China PCB makers expanding capacity for lower-end HDI boards
China-based PCB makers have been expanding production capacities for HDI boards for lower-end handset and consumer electronics applications, but they can hardly develop significant...
Tuesday 25 August 2020
SiP+FPCB may be adopted for iPhone battery modules
SiP (system in package) combined with flexible PCB may be gaining ground in the supply chain of Apple devices, as the vendor reportedly will adopt the combination for its 5G handset...
Thursday 20 August 2020
Taiwan PCB makers eyeing satellite applications
Taiwan PCB makers are eyeing new business opportunities associated with low earth orbit (LEO) satellites, especially those for ground supporting equipment, in the wake of SpaceX successfully...
Thursday 20 August 2020
Taiwan PCB makers feel more pressure to move out of China
Taiwan-based PCB makers, now having over 60% of their production capacity in China, are feeling more pressure to relocate their production plants out of the wolrld's factory amid...
Wednesday 19 August 2020
Taiwan PCB makers concerned about demand gap left by Huawei
Taiwan's PCB supply chain is trying to identify clients who may replace Huawei and HiSilicon, both of whom face tough US trade restrictions, according to industry sources.
Tuesday 18 August 2020
Daeduck to expand ABF substrate capacity for Samsung demand
Korea-based PCB maker Daeduck Electronics, a supplier of Samsung Electronics, will invest KRW90 billion (US$76 million) to expand ABF substrate capacity, according to industry sour...
Thursday 30 July 2020
Unimicron investing big in expanding ABF substrate capacity
Unimicron Technology's board of directors has resolved to allocate NT$17.4 billion (US$594.2 million) in capex for 2021, with over 90% of the sum and the majority of another budget...