Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a...

STATS ChipPAC has announced it is expanding capacity for full turnkey wafer-level packaging in its Singapore operation. The IC packaging and testing service provider said it is on...

Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...