TSMC's first European wafer fab is set to be located in Dresden, Germany, a region already recognized as a significant chip manufacturing hub in both Germany and Europe. This decision...
ESMC has commenced construction on a new semiconductor fabrication facility in Dresden, Germany. The joint venture between TSMC, Robert Bosch, Infineon, and NXP is investing over...
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
Is it time for Intel Foundry (IF) to be spun off as an independent entity? During the 2008-2009 financial crisis, AMD was forced to divest its wafer fabrication division, offloading...
Once the undisputed leader of the semiconductor industry, Intel has seen its market capitalization dwindle significantly compared to its American rivals, Nvidia and AMD. Intel's market...
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
Semiconductor materials supplier Topco Scientific is keenly promoting the use of new materials for CoWoS and other advanced packaging technologies, confident in its operations and...
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
Shin-Etsu Chemical and Sumco, which account for approximately 50% of the global wafer market, have both reported a decline in demand for the April-June 2024 quarter compared to the...
Samsung Display (SDC) is reportedly collaborating with Microsoft to develop and supply OLED on Silicon (OLEDoS) for the next generation of Mixed Reality (MR) devices.
China-based pure-play foundry Semiconductor Manufacturing International Corporation (SMIC) reported a decline in profit despite growing revenue by more than 20% amid intense competition...
Infineon Technologies is set to unveil a new silicon carbide (SiC) wafer fab at its plant site in Kulim, Malaysia, which aims to move from 6-inch to 8-inch production in 2025. Malaysia's...
