Taiwan Semiconductor Manufacturing Company (TSMC) has reiterated that its target of 20% growth in 2011 sales, and earnings-before-tax growth of 20% on a long-term basis remain unchanged,...
Taiwan Semiconductor Manufacturing Company (TSMC) has processed more 12-inch wafers on 28nm processes in the first quarter of 2011, with monthly output ramping up to 5,000 units on...
Altera has announced that it will also utilize low-power process technology from Taiwan Semiconductor Manufacturing Company (TSMC) for its low-cost and midrange 28nm FPGA chips in...
Xilinx has announced its 28nm 7 series FPGAs, which embrace 3D packaging technologies and through-silicon vias (TSV) for applications requiring high-transistor and logic density as...
Industry sources believe that Samsung Electronics is seeking to boost its system LSI operations in addition to its ambition in the memory segment. The leader in DRAM and NAND flash...
Kinsus Interconnect Technology has stepped up shipments of its bismaleimide triazine (BT)-based flip-chip (FC) substrates to Xilinx and Altera in May as the two FPGA chip vendors...
Xilinx has announced its next-generation FPGA family will be built on high-K metal gate (HKMG) 28nm processes at Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics'...
United Microelectronics Corporation (UMC) and Xilinx have jointly announced production qualification for Xilinx' FPGA products built using UMC's 40nm logic process technology on 12-inch...
Xilinx is working closely with its foundry partners, and sees no supply constraints on 40/45nm FPGAs, according to Fai Yeung, vice president of sales for Xilinx Asia Pacific. Demand...
Xilinx and ARM have announced they are collaborating to enable ARM processor and interconnect technology on Xilinx FPGAs. Xilinx is adopting ARM Cortex processor IP, using performance-optimized...
Wireless chipmaker Qualcomm, and FPGA designers Altera and Xilinx have reduced their wafer start orders for the fourth calendar quarter of 2009 to their foundry partners, according...
Taiwan-based IC substrate maker Kinsus Interconnect Technology has seen its capacity utilization for flip-chip chip scale packaging (FC CSP) substrates rise to more than 80% and the...
Most major global semiconductor suppliers that have reported second-quarter results are currently holding lean levels of chip inventory, putting them in a strong competitive position...
United Microelectronics Corporation (UMC) has been working closely with customers, including FPGA specialist Xilinx, to volume produce 45/40nm products at its 300mm (12-inch) fabs,...
Xilinx is reportedly working closely with United Microelectronics Corporation (UMC) and Samsung Electronics, to ensure smooth supply of its recently-announced Virtex-6 and Spartan-6...
