Apple reportedly will continue developing its own mmWave AiP (antenna in package) modules for its next-generation iPhone lineup, with related efforts likely to push the US handset...
5G mmWave AiP (antenna in package) modules are on track to gain increasing penetration in handsets and other devices after being incorporated into iPhone 12 series, and FC-AiP technology...
Taiwan-based IC substrate suppliers including Kinsus Interconnect and Unimicron Technology are expected to gain growth momentum from increasing demand for AiP (antenna in packages)...
Testing house Sigurd Microelectronics is optimistic about its business outlook for 2021, as testing demand for related chips for 5G phone, networking, automotive and AI applications...
The completion of 5G NR R16 standard from 3GPP has been announced the freeze in early July 2020. It is establishing aggressive targets for low latency and massive connection scenarios...
Taiwan's leadframe makers including Jih Lin Technology and SDI have seen clear order visibility through the second quarter of 2021 due to a significant recovery in demand for discrete...
Qualcomm and MediaTek are poised to embrace strong shipment growths for 5G SoC solutions in 2021 as sales of 5G phones are expected to grow exponentially in the coming year, particularly...
The global market has seen unprecedented changes in recent years, including trade tension between US-China, which started in 2018 and spurred a supply chain reshuffle that changed...
Mobile device certification specialist Sporton International has reported net profit of NT$208 million (US$7.3 million) on revenue of NT$926 million for the third quarter of 2020,...
Taiwan-based Flexium Interconnect is set to mass produce mmWave LCP (liquid crystal polymer)-based flexible antenna boards at its new plant in Kaohsiung, southern Taiwan in first-half...
Taiwan-based CCL maker Iteq expects shipments for 5G base stations, particularly sub-6GHz ones, to ramp up significantly in 2021, according to company chairman Dennis Chen.
LitePoint, a leading provider of wireless test solutions, delivered a presentation on its 5G sub-6GHz and mmWave test technologies, as well as next-generation test solutions at the...
First-tier chip designers and PC brand vendors have begun cooperation to develop notebooks with integrated antenna-in-package (AiP) modules to support both sub-6GHz and mmWave 5G...
Taiwan's leading III-V semiconductor player Win Semiconductors is gearing up its foundry support for Qualcomm after having stopped shipments to Huawei/HiSilicon, as the US chipmaker...
