Samsung Electronics unveiled its next-generation process blueprint at the Samsung Foundry Forum 2024 (SFF 2024), but the response from the semiconductor industry has been somewhat...
Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing)...
Samsung's recent announcement of securing a 2nm chip order from Japan's AI accelerator developer Preferred Networks (PFN) has sparked discussions about the actual production progress...
Applied Materials introduced the industry's first use of ruthenium in high-volume production, enabling copper chip wiring to scale to the 2nm node and beyond while reducing resistance...
According to Bloomberg citing UBS forecasts, Taiwan Semiconductor Manufacturing Company (TSMC) could spend up to US$37 billion in capex in 2025, marking a 15.6%...
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...
Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tape-outs.
Semiconductor foundry companies have started to compete in the 2nm process shortly after their 3nm production lines started humming to mass produce for customers. There is something...
As previous subsidies of a total of JPY920 billion (nearly US$6 billion) may not be sufficient to help Rapidus achieve its goal of mass-producing 2nm chips, Japan's Ministry of Economy,...
Japanese semiconductor foundry Rapidus, aiming to mass-produce 2nm chips, has announced a collaboration with US-based AI chip startup Esperanto Technologies to jointly develop desi...
Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...
Synopsys has disclosed extensive EDA and IP collaboration with TSMC for advanced node designs, which have been used in a wide range of AI, high-performance computing, and mobile applications...
