South Korean-based memory giants Samsung Electronics and SK Hynix have recently initiated a wave of recruitment targeting experienced professionals in the high-bandwidth memory (HBM)...
In the race for dominance in high-bandwidth memory (HBM), SK Hynix and Micron have already established the direction for the next generation of HBM packaging technology. However,...
With the global memory market showing signs of recovery, major players like Samsung Electronics, SK Hynix, and Micron are gearing up for intensified competition in 2024, particularly...
The performance of the consumer electronics market, driven by smartphones, has been poor, dragging down the recovery speed of the semiconductor industry, which may be delayed until...
NAND flash prices have been steadily climbing, including a recent spike, according to Wallace Kou, president and CEO of memory device controller IC supplier Silicon Motion Technology...
As NAND flash and high-bandwidth memory (HBM) stacking technologies continue to advance, coupled with the prospective development of 3D DRAM, the semiconductor industry is abuzz with...
Samsung Electronics recently inaugurated the "Next-Generation Process Development Lab" to spearhead the development of "killer-grade" technologies for the semiconductor industry over...
Samsung Electronics is not only investing actively in the R&D and capacity expansion of high-bandwidth memory (HBM) technology, but also looking to broaden its market reach through...
As a result of robust sales of its high bandwidth memory (HBM), SK Hynix's DRAM market share surged to a new peak of 35% in the third quarter of 2023, according to research firm Omdia,...
All major DRAM chipmakers have prioritized DDR5 and high-bandwidth memory (HBM) in anticipation of a surge in demand from generative AI, according to industry sources.
The easing of server GPU and CoWoS packaging supply shortages will boost AI server shipments in 2024, according to DIGITIMES Research senior analyst Jim Hsiao.
Despite odds and challenges amid tightening US restrictions, Huawei Technologies continues to carry on innovation efforts as the company recently announced its 2023...
The Taiwan-based semiconductor manufacturer Winbond is gearing up for a significant uptick in the demand for high-bandwidth memory (HBM), driven by the rise of generative AI. Chen...
Micron Technology expects to kick off volume production of HBM3E memory at its factory site in Taiwan, which the memory chipmaker considers a hub for advanced packaging, in the first...
