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NEWS TAGGED HBM
Wednesday 11 October 2023
Memory and semiconductor foundries face contrasting recovery prospects amid economic shift
As South Korean memory manufacturers anticipate a recovery in Q4 2023, the semiconductor foundry sector reportedly continues to grapple with lingering demand uncertainties.
Tuesday 3 October 2023
Samsung, SK Hynix enhance memory packaging investments, eyeing explosive HBM demand to start in 2024
The demand for high bandwidth memory (HBM) is poised to experience explosive growth starting in 2024, fueled by its incorporation into servers hosting large language models like ChatGPT...
Thursday 21 September 2023
As HBM competition heats up, introduction schedule of 'hybrid bonding' receiving attention
With the increased prevalence of generative AI, the demand for High Bandwidth Memory (HBM) is rapidly rising, leading to heightened competition in stacking. For HBMs, a higher stack...
Tuesday 12 September 2023
Samsung and SK Hynix building 2,000 I/O ports on HBM4
Samsung Electronics and SK Hynix are trying to dominate the rapidly growing high-bandwidth memory (HBM) market both through expanding capacities and revolutionizing the next-generation...
Tuesday 12 September 2023
Samsung, SK Hynix to catch up with TSMC in IC packaging with government help
According to Korean media Money S, the South Korean government and major semiconductor firms have signed a "Semiconductor Advanced Packaging Technology Cooperation Development...
Thursday 7 September 2023
Samsung reportedly developing new generation of DRAM
Recent reports from South Korean media pointed out that after high bandwidth memory (HBM), Samsung Electronics will develop a new generation of DRAM technology.
Tuesday 5 September 2023
Micron to run HBM packaging hub in Taiwan
Micron Technology has disclosed plans for its Taiwan facility to become the hub of advanced packaging for high bandwidth memory (HBM).
Friday 1 September 2023
China reportedly pursuing high bandwidth memory self-sufficiency
China is keen on attaining self-sufficiency in high bandwidth memory (HBM), with ChangXin Memory Technologies (CXMT) to be playing a leading role in the development of HBM, according...
Thursday 31 August 2023
To enhance its HBM competitiveness, SK Hynix expands packaging talents internally
The AI boom has fueled the high-performance semiconductor market. SK Hynix, in light of investment reduction, has elected to expand its HBM technology capabilities through recent...
Thursday 31 August 2023
Samsung breaks through memory bottleneck; announces research results on HBM-PIM and LPDDR-PIM
At the 2023 Hot Chips forum, in addition to Intel's announcement of its data center chip product, the latest report from Korea's TheElec also pointed out Samsung Electronics...
Thursday 31 August 2023
South Korean equipment makers keen on developing new-gen HBM processing tools
The proliferating artificial intelligence (AI) applications are generating significant growth potential in demand for next-generation high bandwidth memory (HBM) chips, driving South...
Wednesday 30 August 2023
SK Hynix accelerates high-NA DRAM development, with trial production set for 2024
After achieving breakthroughs in production technologies for high bandwidth memory (HBM) and 300-layer NAND flash chips, SK Hynix is accelerating the development of the next-generation...
Monday 28 August 2023
Samsung and SK Hynix hitch ride with AI semiconductors as Nvidia's performance soar
Seeing Nvidia's excellent revenue performance in the second quarter of 2023 and the reported plan to expand the production of AI chips like H100, South Korean memory makers like Samsung...
Thursday 24 August 2023
AI server shipments forecast to top 300,000 units in 2024, says DIGITIMES Research
High-end AI server shipments are forecast to reach 337,000 units in 2024, with the generative AI market reaching US$109 billion by 2030, at a compound annual growth rate (CAGR) of...
Tuesday 22 August 2023
Advanced packaging capacity to surge 30–40% in 2024, says TrendForce
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research