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Thursday 14 November 2024
Taiwan IC design houses pursue growth opportunities in challenging auto sector
Leading integrated device manufacturers (IDMs) have expressed concerns about the automotive semiconductor market outlook for 2025. Despite these challenges, Taiwan-based IC design...
Wednesday 30 October 2024
Infineon unveils ultra-thin 20-micrometer power semiconductor wafer
Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer...
Thursday 12 September 2024
Infineon develops 300mm GaN technology
Infineon Technologies has announced the development of the world's first 300mm power gallium nitride (GaN) wafer technology. The company claims to be the first to effectively implement...
Friday 6 September 2024
China-based GaN leader Innoscience slashes prices, other players take action
In the past six months, China's leading GaN compound semiconductor firm Innoscience has faced patent infringement lawsuits in Germany and the US, from power component manufacturers...
Friday 6 September 2024
Power semiconductor makers step up SiC and GaN deployment
The power semiconductor industry is experiencing a surge in the development of compound semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC). These advancements...
Wednesday 21 August 2024
Why Dresden is TSMC's choice for its first wafer fab in Europe
TSMC's first European wafer fab is set to be located in Dresden, Germany, a region already recognized as a significant chip manufacturing hub in both Germany and Europe. This decision...
Wednesday 21 August 2024
TSMC breaks ground on EUR10 billion semiconductor fab in Dresden
ESMC has commenced construction on a new semiconductor fabrication facility in Dresden, Germany. The joint venture between TSMC, Robert Bosch, Infineon, and NXP is investing over...
Tuesday 20 August 2024
ESMC breaks ground on Dresden fab
European Semiconductor Manufacturing Company (ESMC), a joint venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors, has held a groundbreaking ceremony to...
Tuesday 20 August 2024
Foreign GaN providers plan to trap Innoscience with slew of patent disputes
The international patent war over compound semiconductors, specifically Gallium Nitride (GaN), continues to intensify. In July, Efficient Power Conversion (EPC) from the US won a...
Tuesday 20 August 2024
Challenges ahead for Europe's first 12-inch wafer fab
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
Monday 12 August 2024
Government support fuels Malaysia's new Infineon Kulim plant
Infineon inaugurated its new 8-inch SiC semiconductor plant in Kulim, Malaysia, on August 8.
Friday 9 August 2024
What makes Malaysia so attractive to companies like Enovix and Infineon?
Enovix, a next-generation 3D silicon-lithium battery design and manufacturing company founded in 2007, is a global leader in high-performance battery technology. On August 8, it announced...
Friday 9 August 2024
Five key takeaways from Infineon 8-inch SiC fab opening event
Infineon has built a new plant in Kulim Hi-Tech Park, Malaysia, dedicated to generating 8-inch silicon carbide (SiC) wafers. Here are five major takeaways from the new facility's...
Thursday 8 August 2024
Infineon capable of handling short-term SiC market volatility, says company exec
Infineon has a solid basis in SiC production technology capabilities and intends to mitigate potential market oversupply and other market headwinds by capitalizing on its superior...
Thursday 8 August 2024
Infineon opens new SiC fab in Malaysia
Infineon Technologies is set to unveil a new silicon carbide (SiC) wafer fab at its plant site in Kulim, Malaysia, which aims to move from 6-inch to 8-inch production in 2025. Malaysia's...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research