Robust sub-7nm chip demand buoyed IC design service company Alchip Technologies' profit performance in the first half of 2022, when the company saw sales for HPC processor orders...
Qualcomm and MediaTek are under increasing pressure to cut their mobile application processor prices amid reports that Android smartphone vendors, including Samsung Electronics, are...
Oppo has rolled out its first wearable series featuring LTPO AMOLED display technology, with FocalTech Systems being the exclusive supplier of related AMOLED TDDI chips.
Competition between Qualcomm and MediaTek in the 3nm smartphone application processor (AP) market is poised to take place in the second half of 2023, according to market sources....
Qualcomm and Marvell have both notified their customers about price increases that may come into effect as early as August, joining a few chip suppliers including Intel and TSMC looking...
IC design houses are bracing for a particularly weak third-quarter 2022 while also having difficulty negotiating lower foundry quotes, according to industry sources in Taiwan.
TSMC has seen its major clients adjust downward their chip orders for the rest of 2022, which may prompt the pure-play foundry to cut its revenue outlook for 2022, according to industry...
LG Electronics has launchednew series of OLED TVs, including its Objet lineup, in Taiwan, aiming to ramp up the sale value of OLED TVs by 30% in 2022 compared to...
SiFive announced the release of the latest version of its SiFive Intelligence X280 processor, which introduces significant new features including scalability up to a 16-core cache-coherent...
Robust AI and HPC processor orders have boosted TSMC's chip-on-wafer-on-substrate (CoWoS) packaging capacity utilization to nearly 100%, according to industry sources.
Taiwan-based cooling solution provider Jentech Precision Industrial is optimistic about its operation in the second half of 2022 as demand from datacenter servers, and electric vehicles...
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Cloud service providers will depend less on processor vendors as more of them are looking to develop their own Arm-based processors, according to sources in the notebook industry...