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Thursday 18 June 2020
Nan Ya PCB looks to ABF, SiP substrates for profit growth in 2020
Nan Ya PCB will be striving to boost its profits in 2020 by focusing more on shipments of high-value products such as ABF and SiP substrates, according to company chairman CC Wu.
Friday 12 June 2020
ABF substrate shortages may widen into 2021
ABF substrate supply shortfalls are likely to widen further into 2021 as demand for 5G infrastructure, networking and high-end GPU and CPU applications has outgrown capacity expansions...
Friday 12 June 2020
US trade ban on Huawei may cast shadow over 2H20 IC market, says Chang Wah
New US trade sanctions against Huawei will bring "uncontrollable variables" to the IC market in the second half of 2020, according to Canon Huang, chairman and president for IC packaging...
Thursday 11 June 2020
COF substrate maker JMC uncertain about 3Q20
Chip-on-film (COF) substrate supplier JMC Electronics has expressed uncertainty about its outlook for the third quarter of 2020 due mainly to fluctuations in demand, according to...
Friday 5 June 2020
IC substrate makers shifting focus to US clients from Huawei
Taiwan-based IC substrate makers including Unimicron Technology and Na Ya PCB are gearing up to strengthen business ties with US clients seeking to offset expected losses of orders...
Tuesday 2 June 2020
Networking to drive ABF substrate market growth in 2H20
Networking devices, in addition to servers, will be driving the ABF substrate market growth in the second half of 2020 bolstered by growing demand to support remote activities, according...
Thursday 28 May 2020
Kinsus gearing up to expand presence in FCBGA, AiP fields
Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from...
Tuesday 26 May 2020
Glass substrate landscape changing in line with reductions in Korea LCD fabs
The global landscape for the supply of display glass substrates is changing along with the moves by Samsung Display and LG Display to gradually withdraw from the LCD panel market.
Thursday 21 May 2020
ABF substrates in strong demand for HPC CPUs, GPUs
ABF substrates are expected to see long-term robust demand for processing high performance computing (HPC) GPU and CPU chips solutions as chipmakers are pursuing constant upgrades...
Thursday 21 May 2020
Unimicron, Nan Ya say ABF substrate investment plans remain in place
Taiwan's major IC substrate makers Unimicron Technology and Nan YA PCB have stressed that their investments in capacity expansion and R&D for ABF substrates will not be affected...
Wednesday 13 May 2020
Nan Ya PCB swings to profit in 1Q20
Nan Ya PCB returned to profitability in the first quarter of 2020, driven by strong shipments of its high-end ABF substrates.
Tuesday 12 May 2020
Unimicron embraces brisk orders for ABF substrates
Unimicron Technology has seen clear order visibility for ABF substrates at least through the third quarter, with the orders mainly for 5G infrastructure, networking and HPC chips...
Monday 11 May 2020
Zhen Ding, Unimicron looking to extend lead over peers via bold capex injection
The coronavirus pandemic may force many Taiwan-based PCB makers to slow down their capacity expansion plans in the short term due to uncertain market prospects, but Zhen Ding Technology...
Wednesday 29 April 2020
Kinsus swings to profit in 1Q20 on strong ABF substrate shipments
IC substrate supplier Kinsus Interconnect Technology swung to net profits of NT$79 million (US$2.6 million) in the first quarter 2020 on revenues of NT$5.89 billion, from losses a...
Wednesday 29 April 2020
TSMC lands additional InFO packaging orders from Nephos
TSMC has landed additional InFO (integrated fan-out) packaging orders requiring short lead times from MediaTek's Nephos, according to industry sources.