Taiwan-based IC substrates suppliers are poised to benefit from Apple's move to adopt both TSMC's InFO_AiP (antenna in package) technology and ASE's FC_AiP process to package its...
STMicroelectronics has signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company, according to the companies.
IC substrate makers Nan Ya PCB and Kinsus Interconnect are both expected to post significant revenue and profit increases in 2020 as robust demand from segments of smartphones, servers,...
Taiwan IC substrate makers will have no time to lose in expanding their ABF substrate capacities as demand for such substrates will grow substantially in 2020 and beyond along with...
The output value of Japan's PCB industry dropped 7.4% from a year earlier to JPY38.34 billion (US$1.27 billion) in October 2019, contracting for the 10th consecutive month, according...
Taiwan-based niche-type CCL maker Ventec International expects its gross margin to reach over 25% for whole-year 2019 thanks to volume production of its new high-end materials and...
While China's homegrown processor makers are gearing up to develop new-generation solutions to serve huge domestic PC replacement demand, Taiwan-based Unimicron Technology and Nan...
Solar-grade crystalline silicon wafer maker Sino-American Silicon Products (SAS) is set to merge with Sunrise PV World, its wholly owned subsidiary PV EPC (engineering, procurement,...
TSMC has placed orders for several hundred sets of test equipment with Teradyne, and will install the tools at the foundry's new advanced backend plant in northern Taiwan, according...
Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen their shipments ramp up in most of fourth-quarter 2019 with...
Taiwan-based PCB specialist Zhen Ding Technology has decided to enforce a capital increment of US$50 million at its second IC substrate subsidiary to build new capacity for advanced...
Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP...
Notebook vendors are ready to adopt mini LED backlighting for their devices, paving the way for the technology to move beyond public signage to consumer electronics, according to...
Chip-on-film (COF) substrate supplier JMC Electronics has seen orders for large-size display driver IC packaging slow down in the fourth quarter of 2019, for which the company is...
Cree and STMicroelectronics have announced the expansion and extension of an existing multi-year, long-term silicon carbide wafer supply agreement to more than US$500 million. The...
