COF substrate makers and related packaging houses are expected to operate at full capacity through the end of 2019 on robust demand from smartphone vendors, and their revenues may...

Unimicron Technology has maintained its huge capex budgets for 2019 and 2020 are meant to strengthen its IC substrates technology upgrades and production capacity for the emerging...

With 5G business opportunities starting to emerge, CCL makers have been keenly increasing their capacity to satisfy...

Chip and component demand for 5G related applications, including network equipment, and antennas for handsets and IoT devices, is set to grow robustly starting 2020. In the PCB industry...

ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...

The output value of Japan's PCB industry dropped 6.9% from a year earlier to JPY219.79 billion (US$2.06 billion) in the first half of 2019, with that of the flexible PCB sector experiencing...

Chip-on-film (COF) substrate supplier JMC Electronics has enjoyed robust demand for semi-additive tape COF packaging services, boasting clear order visibility through the first half...

PCB and IC substrate supplier Unimicron Technology has set aside a capex of approximately NT$16.2 billion (US$514.5 million) for 2020, up from NT$9.2 billion for 2019, to strengthen...

Among Taiwan IC substrates makers, Unimicron and Na Ya PCB are expected to benefit the most from AMD release of its EPYC Rome 7002 server CPU adopting TSMC 7nm node and supporting...

IC substrate suppliers are moving to allocate part of their substrate-like PCBs (SLP) capacity to support production of ABF substrates that see robust demand, according to industry...

Rigid-flexible PCB maker Dynamic Electronics has dismissed a recent Chinese-language report indicating the company plans to sell its factory site in Taiwan to a fellow Taiwan-based...

Taiwan-based backend houses and COF substrate suppliers will see orders from Huawei pick up in July or August, according to industry sources.

Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...

Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...

The ever-growing demand for high-performance computing (HPC) chips to support 5G and AI applications is ushering in a long-missed market recovery for ABF substrates needed for high-end...