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NEWS TAGGED SUBSTRATE
Monday 26 August 2019
CCL, IC substrate and flexible PCB demand to boom in 5G era
Chip and component demand for 5G related applications, including network equipment, and antennas for handsets and IoT devices, is set to grow robustly starting 2020. In the PCB industry...
Thursday 22 August 2019
ABF substrate demand to stay robust through 2020
ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...
Wednesday 21 August 2019
Japan PCB industry output value drops in 1H19
The output value of Japan's PCB industry dropped 6.9% from a year earlier to JPY219.79 billion (US$2.06 billion) in the first half of 2019, with that of the flexible PCB sector experiencing...
Thursday 15 August 2019
COF substrate maker JMC sees clear order visibility through 1H20
Chip-on-film (COF) substrate supplier JMC Electronics has enjoyed robust demand for semi-additive tape COF packaging services, boasting clear order visibility through the first half...
Wednesday 14 August 2019
Unimicron to boost capex in 2020 to deepen ABF substrate deployment
PCB and IC substrate supplier Unimicron Technology has set aside a capex of approximately NT$16.2 billion (US$514.5 million) for 2020, up from NT$9.2 billion for 2019, to strengthen...
Friday 9 August 2019
PCB makers to enjoy brisk ABF substrates demand for AMD new server CPU
Among Taiwan IC substrates makers, Unimicron and Na Ya PCB are expected to benefit the most from AMD release of its EPYC Rome 7002 server CPU adopting TSMC 7nm node and supporting...
Wednesday 7 August 2019
PCB makers increasing ABF substrate capacity
IC substrate suppliers are moving to allocate part of their substrate-like PCBs (SLP) capacity to support production of ABF substrates that see robust demand, according to industry...
Wednesday 17 July 2019
PCB maker Dynamic denies report it will sell Taiwan plant
Rigid-flexible PCB maker Dynamic Electronics has dismissed a recent Chinese-language report indicating the company plans to sell its factory site in Taiwan to a fellow Taiwan-based...
Tuesday 16 July 2019
Taiwan backend houses to see Huawei orders pick up
Taiwan-based backend houses and COF substrate suppliers will see orders from Huawei pick up in July or August, according to industry sources.
Wednesday 10 July 2019
Order visibility for IC packaging materials clear throughout 3Q19
Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...
Tuesday 2 July 2019
TDDI IC supply chain turns optimistic about 2H19 on Huawei ban easing
Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...
Wednesday 26 June 2019
Unimicron, Na Ya to gain from high-specs ABF substrates in 2H19
The ever-growing demand for high-performance computing (HPC) chips to support 5G and AI applications is ushering in a long-missed market recovery for ABF substrates needed for high-end...
Wednesday 26 June 2019
COF substrate firm JMC to enjoy record sales in 2Q19
Chip-on-film (COF) substrate suppliers JMC Electronics is expected to see its revenue and profit climb to record-high levels in the second quarter of 2019, driven mainly by a rally...
Monday 24 June 2019
Yageo chairman takes helm of Tong Hsing
Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...
Tuesday 18 June 2019
Chang Wah growing pre-mold QFN leadframe offering
Chang Wah Technology (CWTC) continues to enhance its pre-mold quad flat no-lead (QFN) leadframe offerings, and has developed pre-mold metal substrate (PMMS) technology for the emerging...