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Thursday 1 November 2018
Chipbond posts record 3Q18 profit
LCD driver IC backend specialist Chipbond Technology has reported net profits climbed to a record high of NT$2.71 billion (US$87.6 million) in the third quarter of 2018. EPS for the...
Wednesday 17 October 2018
Flexium, Unimicron fined for environmental violations in China
Taiwan-based Flexium Interconnect and Unimicron Technology have both been fined for violating environmental regulations in Kunshan, China.
Friday 28 September 2018
ABF substrate supply becomes tight
The supply of ABF (ajinomoto build-up film) substrates has become tight, thanks to growing demand for server and high-performance computing applications, according to industry sour...
Wednesday 5 September 2018
FCBGA substrate supply tight on packaging demand for pre-5G chips
Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products,...
Thursday 23 August 2018
Nanya PCB striving to cut loss
Nanya Printed Circuit Board is striving to lower its operating losses by developing high-margin products such as those for automotive electronics, 5G and AI applications, according...
Wednesday 22 August 2018
Driver IC backend firms ink 3-year supply contracts
Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...
Monday 6 August 2018
Unimicron China subsidiary fined for violating environmental regulations
Unimicron Technology (Kunshan), a subsidiary of Taiwan-based PCB and IC substrate manufacturer Unimicron, has been fined CNY380,000 (US$55,520) for breaking local environmental laws,...
Tuesday 26 June 2018
COF packaging substrate, service suppliers bracing for strong sales in 2H18
Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...
Friday 15 June 2018
Ventec to apply for listing on TWSE mainboard
Copper clad laminate (CCL) supplier Ventec International plans to apply for listing on the Taiwan Stock Exchange (TWSE) mainboard in the first quarter of 2019, according to company...
Tuesday 12 June 2018
Yageo not to drop production of commodity MLCCs, says chairman
Taiwan leading passive component maker Yageo will still do its best to satisfy customer demand for standard-type MLCCs for consumer devices despite its enhanced deployments in niche-type...
Friday 11 May 2018
Corning opens 10.5G LCD glass substrate facility in China
Corning has unveiled its new 10.5G LCD glass substrate manufacturing facility co-located with the BOE Technology Group (BOE) plant in the Hefei Xinzhan Hi-Tech Industrial Development...
Friday 20 April 2018
OSAT firms see flip-chip package orders eroded by digital coin price swings
Taiwan OSAT (outsourced semiconductor assembly and test) firms are facing headwinds in striving for flip-chip packaging orders for cryptocurrency mining ASICs, as the sharp price...
Friday 20 April 2018
Global semiconductor packaging materials market reaches US$16.7 billion in 2017
The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...
Tuesday 20 March 2018
COF demand to receive boost in 2H18, says JMC
Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...
Monday 5 March 2018
ASE-TDK JV start operations
ASE Embedded Electronics, a joint venture between Advanced Semiconductor Engineering (ASE) and TDK, has started operations.