Taiwan-based IC substrate maker Kinsus Interconnect Technology has announced a net EPS of NT$8.11 (US$0.26) for 2014, the highest level in seven years.
Taiwan-based IC substrate makers Unimicron Technology, Kinsus Interconnect Technology and Nanya PCB will continue to ramp up their production capacities for flip-chip chip scale package...
IC packaging material and tool distributor Niching Industrial looks to ramp up its shipments of EMC-based (epoxy molding compound) LED leadframes and FC CSP substrates to drive revenue...
While China-based panel makers have been expanding production capacities to increase global market share, China-based glass substrate makers, mainly the Tunghsu Group, Irico Display...
Major Taiwan-based IC substrate suppliers are set to post strong revenue growth in the second half of 2014 in line with booming sales at wafer foundry houses and IC backend service...
Strong LED market demand in 2014 has led to expanded patterned sapphire substrate (PSS) production capacity, according to LEDinside. The 4-inch PSS market is currently facing supply...
Out of sapphire substrate non-LED applications, mobile devices have shown the strongest demand. Sapphire substrate non-LED applications are projected to reach a 32% share in 2014,...
China-based PCB maker Shennan Circuits has begun small-volume production of wirebond substrates with mass production to start in the third quarter of 2014. Fellow company Founder...
IC substrate suppliers Ibiden, AT&S, Kinsus Interconnect Technology and Unimicron Technology are expected to compete fiercely for IC substrate orders using 20nm and below processes...
Automatic optical inspection (AOI) tool maker Machvision expects orders from the IC substrate sector to be the growth driver for 2014, according to company chairman Wang Kuang-hsia...
Taiwan-based IC substrate and backup board makers will ramp up their investments in 2014 for the development of high-end substrates and backup boards for advanced foundry processes,...
China-based PCB makers have begun shipping IC substrates, high-end multi-layer boards and HDI boards for notebook, networking device and consumer electronics applications, which will...
IC substrate makers Kinsus Interconnect Technology, Unimicron Technology and Nanya PCB all plan to ramp up their production capacity for flip-chip chip scale package (FC CSP) substrates...
Taiwan-based IC substrate suppliers including Kinsus Interconnect Technology and Unimicron Technology expect no impact from a possible shutdown of Advanced Semiconductor Engineering's...
