CONNECT WITH US
NEWS TAGGED SUBSTRATE
Friday 14 June 2019
Unimicron to build new IC substrate plant
Unimicron Technology is scheduled to break ground for a new plant in Taoyuan, northern Taiwan in July followed by equipment move-in a year later. The new facility is designed for...
Thursday 13 June 2019
JMC finds strength to compete with bigger rivals
Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...
Wednesday 12 June 2019
JMC expects flat growth or slight decrease in 3Q19 revenues
Chip-on-film (COF) substrate suppliers JMC Electronics expects to post flat growth or a slight decrease sequentially in third-quarter revenues, due to a cutback in orders in the wake...
Monday 10 June 2019
Shennan Circuits expanding IC substrate market presence
China's Shennan Circuit has managed to generate profits from its IC substrate business, and has expanded its IC substrate offerings to include those for handset-use application processors...
Monday 10 June 2019
CCL maker EMC optimistic about 2019
CCL firm Elite Materials (EMC) has expressed optimism about its revenue and profit performance in 2019, driven mainly by rising product ASPs.
Wednesday 5 June 2019
Unimicron, Kinsus to expand additional ABF substrate capacities
Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...
Tuesday 4 June 2019
COF packaging demand for smartphones remains promising
Suppliers engaged in the supply chain for chip-on-film (COF) packaging remain optimistic about demand coming from the smartphone sector, citing the rising popularity of bezel-less...
Wednesday 15 May 2019
ABF substrate supply remains tight
The supply of ajinomoto build-up film (ABF) substrates has been tight, and will continue to fall short of demand in the second half of 2019, according to industry sources.
Tuesday 14 May 2019
Nan Ya PCB posts smaller loss in 1Q19
PCB and IC substrate maker Nanya Printed Circuit Board saw its net loss improve to NT$278 million (US$8.9 million) in the first quarter from loss of NT$677.9 million during the same...
Monday 13 May 2019
Unimicron to pour US$20 billion into FC substrate biz over next 4 years
Unimicron Technology has disclosed plans to invest a total of NT$20 billion (US$644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates...
Friday 3 May 2019
Huawei demanding more COF substrate supply
Huawei has demanded more supplies from Taiwan-based chip-on-film (COF) substrate manufacturers including JMC Electronics and Chipbond Technology (formerly Simpal Electronics), and...
Wednesday 17 April 2019
CCL firm Ventec listed on TWSE, poised to grab 5G opportunities
Ventec International, a supplier of copper clad laminates (CCL), has officially got listed on the Taiwan Stock Exchange (TWSE) on April 17 as the fourth listed Taiwanese CCL supplier,...
Tuesday 2 April 2019
Unimicron to spend 60% of 2019 capex on IC substrates
PCB and IC substrate supplier Unimicron Technology expects about 60% of its capex this year to be spent on IC substrate production.
Friday 29 March 2019
Nan Ya PCB eyeing return to profit
PCB and IC substrate maker Nan Ya PCB, which managed to cut its losses substantially in 2018, is eyeing a return to profitability in 2019.
Friday 29 March 2019
ABF substrate demand promising
Ajinomoto build-up film (ABF) substrate demand will remain robust and be even more bullish in the era of 5G, when a diverse range of applications emerges, according to industry sou...