Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...

Suppliers engaged in the supply chain for chip-on-film (COF) packaging remain optimistic about demand coming from the smartphone sector, citing the rising popularity of bezel-less...

The supply of ajinomoto build-up film (ABF) substrates has been tight, and will continue to fall short of demand in the second half of 2019, according to industry sources.

PCB and IC substrate maker Nanya Printed Circuit Board saw its net loss improve to NT$278 million (US$8.9 million) in the first quarter from loss of NT$677.9 million during the same...

Unimicron Technology has disclosed plans to invest a total of NT$20 billion (US$644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates...

Huawei has demanded more supplies from Taiwan-based chip-on-film (COF) substrate manufacturers including JMC Electronics and Chipbond Technology (formerly Simpal Electronics), and...

Ventec International, a supplier of copper clad laminates (CCL), has officially got listed on the Taiwan Stock Exchange (TWSE) on April 17 as the fourth listed Taiwanese CCL supplier,...

PCB and IC substrate supplier Unimicron Technology expects about 60% of its capex this year to be spent on IC substrate production.

PCB and IC substrate maker Nan Ya PCB, which managed to cut its losses substantially in 2018, is eyeing a return to profitability in 2019.

Ajinomoto build-up film (ABF) substrate demand will remain robust and be even more bullish in the era of 5G, when a diverse range of applications emerges, according to industry sou...

Speculation has circulated recently in Taiwan's industry about a new company that will be set up jointly by the local LCD panel and driver IC companies to specialize in the manufacture...

COF substrate makers plan to adjust upward quotes for the second quarter by 8-15% sequentially to reflect their tight supplies, according to market sources.

China PCB maker Shennan Circuits Company has reportedly landed orders from network equipment vendors such as ZTE and Ericsson for 5G base station applications, indicating its efforts...

Chipbond Technology, a backend house specializing in display driver ICs, is expected to see its revenues buck seasonal patterns in the first quarter of 2019 followed by robust performance...

PCB and IC substrate supplier Unimicron Technology has decided to increase its capex budget this year by NT$2.32 billion (US$75.5 million) to total NT$8.3 billion, according to a...