LED backlight products may see their prices increase by 5-10% as both upstream LED chip and epitaxial wafer prices will rise soon due to strong market demand, according to sources...
Unimicron Technology plans to ramp up its capacity for flip-chip (FC) substrates by 15-18% in the third quarter to meet increasing demand, company spokesman Shen Tsai-sheng said at...
Laser Tek, which mainly produces SMD (surface-mount-device) packaging materials, and chip-resistor substrate supplier Leatec Fine Ceramics are expected to see second-quarter revenues...
LED ceramic substrate maker Tong Hsing Electronic Industries (THEIL) is ramping up output at its plant in Taiwan as the company's new plant in the Philippines is waiting for verification...
LG Display (LGD) has devoted one-fourth of its 6G capacity to rolling out notebook panels, helping the company widen its gap with competitors in the segment, according to industry...
Packaging material and equipment supplier Chang Wah Electromaterials (CWE) has decided to deal out dividends of NT$6 in cash for 2009, based on the pre-tax profits of NT$564 million...
Corning Taiwan's production is running at full capacity to meet customer needs and re-establish its inventory level at the same time due to growing demand for LCD, and the company...
The supply of IC substrates is expected to become tight, or even fall short of demand, in the second half of 2010 due to strong market demand for handset and graphics card chips,...
Chimei Innolux Corporation (CIC) is ramping up the capacity of its 8.5G LCD panel plant and expects to have a monthly capacity of 60,000 substrates in the third quarter of 2011, according...
Small- to medium-size LCD panel maker Giantplus Technology has announced it will acquire a 3.5G color filter (CF) line in Taiwan from Chunghwa Picture Tubes (CPT) for NT$1.3 billion...
Ta-I Technology plans to spend NT$1 billion (US$31.45 million) in the next two years expanding chip resistor, protective component and LED heat sink substrate lines, according to...
Taiwan-based Chip resistor maker Ta-I Technology has stepped into the ceramic heat sink substrate segment and is sampling related products, which are mainly used in LED applications,...
Kinsus Interconnect Technology has seen its order visibility extend to May 2010, with new orders focusing on bismaleimide triazine (BT)-based flip-chip chip scale packaging (FC CSP)...