With memory chipmakers ready to scale up output, industry sources indicated that backend houses are optimistic about orders from the memory sector beginning in the second quarter...

According to King Yuan Electronics (KYEC), the IC testing specialist is bullish about the AI and HPC chip market. The company anticipates an increase in testing volume in the second...

The memory market will grow at a faster rate than the display driver IC (DDI) segment in 2024, according to ChipMOS Technologies, a backend house specializing in memory chips and...

Taiwan-based Lingsen Precision Industries, which specializes in power management IC, sensor, and memory module backend services, recently announced the sale of its subsidiary Ningbo...

Powertech Technology (PTI) will see its high-bandwidth memory (HBM) development project start contributing sales between the fourth quarter of 2024 and the first quarter of 2025,...

Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.

IC backend houses anticipate a resurgence in demand during the latter part of 2024 after a disappointing 2023.

India is bound to be a strategic partner for the United States in terms of demographics, domestic market, software talents, and national strategy.

Micro Silicon Electronics, a power IC backend specialist, is optimistic regarding the long-term demand for AI device applications.

Semiconductor demand is improving gradually, with IC packaging and testing houses expressing optimism about market prospects for 2024 and focusing on AI chips and Co-Packaged Optics...

Everlight Electronics expects its compound semiconductor packaging and testing business to enjoy robust growth in 2024, according to the LED packaging house. It expects related orders...

As a result of the high demand for advanced packaging materials in 2024, IC packaging material distributors such as Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific,...

Many Chinese device assemblers and IC design houses are investing in the backend sector or building their own packaging and testing lines, indicating a trend toward vertical integration,...

OSAT ASE Technology Holdings (ASEH) is on track to increase sales in 2024 as a result of strong demand for advanced packaging and a recovery in demand from consumer device applications,...

Taiwan-based IC backend firms, including Winstek Semiconductor (formerly STATS ChipPAC Taiwan), are positioning themselves to take advantage of robust demand for high-end packaging...