TSMC chairman C.C. Wei revealed that the "richest guy in the world"—widely believed to be Tesla CEO Elon Musk—shared his focus on developing multifunctional robots over...
Intel CEO Pat Gelsinger retired on December 1, 2024, leaving CFO David Zinsner and senior executive Michelle Johnston Holthaus to serve as interim co-CEOs. While the board works to...
The surging AI market has driven unprecedented demand for high-bandwidth memory (HBM), placing significant strain on supply chains. In early August, reports surfaced that the Biden...
According to ET News, SK Hynix is setting its sights on the semiconductor packaging market by offering packaging foundry services, a move that analysts say capitalizes on...
In response to the US export control regulations introduced on December 2, China's Ministry of Finance issued a notice on December 5 regarding government procurement standards and...
According to Nikkei, Rapidus chairman Tetsuro Higashi stressed in an interview that achieving the goal of producing 2nm chips involves overcoming three significant challenges-...
At SEMICON Japan 2024, JASM president Yuichi Horita announced that TSMC's first wafer fab in Kumamoto, Japan, is on track to begin mass production within 2024, reports Nikkei...
ET News highlighted challenges in South Korea's semiconductor materials industry, as sluggish markets and declining demand hit companies like LPN, Technium, and SK Enpulse...
Two pivotal areas in the semiconductor industry- standard DRAM and mature logic processes—are undergoing significant shifts. Despite their independence, both segments share...
Foxsemicon Integrated Technology Inc. (FITI), a subsidiary of Foxconn specializing in semiconductor equipment, is expanding its footprint in Thailand with a THB10.5 billion (approx...
Morris Chang, founder of TSMC, shared candid opinions about leading figures and companies in the tech industry during the launch of his autobiography. The event, attended by former...
Chinese SiC substrate vendors are seeking to expand beyond their home market where prices have collapsed amid severe oversupply, according to industry sources.
According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...
