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Thursday 3 October 2024
China's largest OSAT provider JCET finalizes acquisition of WD's subsidiary in Shanghai
On September 30, 2024, JCET, a prominent leader in China's semiconductor packaging and testing industry, announced that its wholly-owned subsidiary, Changjiang Management Co., had...
Thursday 3 October 2024
Samsung reportedly shuts down equipment to cut losses amid foundry overcapacity crisis
Samsung Electronics is grappling with a foundry overcapacity crisis, despite its strategy of building capacity ahead of demand. According to reports from Chosun Biz and Bloomberg,...
Thursday 3 October 2024
NSTC aims to finalize plans for Czech IC design training base by December
Plans to provide local chip design and basic training in Prague under the Taiwan Chip-based Industrial Innovation Program (Taiwan CbI) in October have reportedly been affected due...
Thursday 3 October 2024
Taiwan wafer foundry industry expected to go up 18% sequentially in 2H24, says DIGITIMES Research
Boosted by short-term orders in the electronics supply chain and shipments of AI and high-performance computing (HPC) chips, Taiwan's wafer foundry industry posted better-than-expected...
Thursday 3 October 2024
Rapidus struggles to secure funding amidst 2nm chip ambitions
Rapidus, a Japanese semiconductor startup aiming to mass-produce 2nm chips by 2027, faces significant funding, technology, and market competitiveness challenges.
Thursday 3 October 2024
TSMC and G42 connection: Cerebras faces supply chain and geopolitical risks under scrutiny amid IPO
Cerebras Systems, a leading competitor in the AI processor market dominated by Nvidia, is preparing for an initial public offering (IPO) on Nasdaq. The company's S-1 filing reveals...
Thursday 3 October 2024
US bets on AI to develop sustainable materials, strengthen semiconductor leadership
The US Department of Commerce has announced a new initiative to maintain the country's semiconductor industry leadership by leveraging artificial intelligence (AI) to develop sustainable...
Thursday 3 October 2024
TSMC's backend equipment suppliers benefit from AI chip demand
Strong AI chip demand has led to full utilization of TSMC's fab capacity, benefiting related suppliers such as Siliconware Precision Industries (SPIL) and equipment manufacturers...
Wednesday 2 October 2024
Sumitomo Metal Mining to mass produce 8-inch SiC wafers
Sumitomo Metal Mining has unveiled plans to significantly increase its production of SiC wafers. The company's subsidiary, Sicoxs, will establish a new production line in Japan to...
Wednesday 2 October 2024
Intel's fall from grace: a cautionary tale of missed opportunities and missteps
What happens when a tech giant starts to stumble? For outsiders, Intel's decline may come as a shock. However, for industry insiders, the failure of the semiconductor giant can be...
Wednesday 2 October 2024
Arm expresses interest in Intel's product division despite x86 rivalry
Reports suggest that in addition to Qualcomm, Arm has expressed interest in acquiring Intel's product division. However, public speculation indicates that due to the deep-rooted rivalry...
Wednesday 2 October 2024
Synopsys enhances EDA and IP solutions for TSMC advanced technologies with new capabilities
Synopsys has announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate...
Wednesday 2 October 2024
Taiwanese chip makers' cultural sensitivity put to the test in Japan
Cultural sensitivity has not always been a strength of Taiwanese businesses, potentially straining Taiwan-Japan relations as Taiwan's semiconductor ventures expand overseas without...
Wednesday 2 October 2024
IC design houses seek lower quotes for mature chipmaking processes
IC design firms are aggressively negotiating with foundry partners to achieve lower quotes for mature process manufacturing in order to alleviate cost pressure, according to industry...
Wednesday 2 October 2024
Foxconn confirms investments in India, likely its OSAT venture with HCL
Foxconn reportedly plans to invest approximately US$50 million in its Outsourced Semiconductor Assembly and Test (OSAT) joint venture with HCL, as India continues to offer attractive...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research