VIA Technologies has announced the VIA ART-3000, a fanless and rugged embedded box system based on the Em-ITX form factor motherboard, offering a solution for a variety of industrial...
Flexible copper-clad laminate (FCCL) maker Taiflex Scientific has announced that it will take up a 68% share in optical protective film maker Koatech Technology through a stock swap...
VIA Technologies has announced plans to demonstrate a dual GPU add-in-board, the S3 Graphics Chrome 5400E x2, aimed at multi-display digital signage applications at Digital Signage...
VIA Technologies saw January 2010 revenues drop 11.35% sequentially to NT$368 million (US$11.48 million) and remain flat compared to the same period in 2009.
Cher Wang, chairperson of Taiwan-based HTC (High Tech Computer) and VIA Technologies, has subscribed to over 50% of 28 million new preferred shares issued by Taiwan-based crystalline...
Worldwide PC processor shipments in the fourth quarter of 2009 rose modestly, compared to the third quarter, but still achieved all-time record levels for a single quarter, according...
VIA Technologies has announced the VIA EPIA-T700, the first motherboard based on the recently announced Mobile-ITX form factor. Measuring 6×6cm, the VIA EPIA-T700 is a compact...
VIA Technologies has unveiled the VIA VL810 SuperSpeed Hub Controller, the industry's first integrated single chip solution to support the higher transfer rates of the new USB 3.0...
Taiwan-based IC distributors have expressed concerns about profits from USB 3.0 product lines despite prospects of their strong sales in the market, as quotes of USB 3.0 device controller...
VIA Technologies has announced the VIA VN1000 digital media chipset for next generation desktop and all-in-one PCs, offering a high definition (HD) multimedia entertainment platform...
VIA Technologies has posted revenues of NT$375.7 million (US$11.65 million) for November 2009, down 12.4% sequentially and 8.9% on year. For the first 11 months of 2009, revenues...
VIA Technologies has announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices.
Worldwide PC processor shipments in the third quarter of 2009 rose substantially by an all-time record level for a single quarter, according to data from IDC. PC processor unit shipments...
