Kioxia has officially inaugurated its second building (K2) and a new management office at its Kitakami factory in Iwate Prefecture. While navigating through industry headwinds, the...
The memory module industry faces significant challenges in the fourth quarter of 2024, with Transcend Information experiencing substantial inventory depreciation losses amid plummeting...
Donald Trump's potential return to the White House has done little to dispel Beijing's anxiety about the direction of US policies concerning China. The next Trump administration's...
High client inventory levels and slower clearance rates contributed to a slowdown in GlobalWafers' silicon wafer shipments for 2024, resulting in a 38.9% drop in after-tax profit...
SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute...
SK Hynix plans to reduce its legacy DRAM production to 20% by the fourth quarter of 2024, responding to increased supply and pricing pressure from Chinese memory manufacturers. The...
Memory intellectual property (IP) firm AP Memory Technology has seen AI drive an uptick in sales, even as its IoT business has yet to rebound. With quarterly gross margin back on...
ChipMOS Technology has embraced a cautious approach to capital expenditures for 2025 and anticipates that the demand for display driver ICs will experience a more pronounced correction...
Samsung Electronics plans to open its new semiconductor research and development campus in mid-November. The installation of advanced equipment is set to take place from November...
Following Nvidia's footsteps, AMD is set to establish an R&D center in Taiwan. The project has received approval from the Ministry of Economic Affairs (MOEA) under its "Global...
Nvidia CEO Jensen Huang emphasized during a video call at the SK AI Summit in Seoul's Coex that he aims to strengthen collaboration with SK Hynix in the high bandwidth memory (HBM)...
SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer count—in the first quarter of 2025. CEO Noh-Jung...
Samsung Electronics and SK Hynix are advancing next-generation memory technology with "ultra-low-temperature" etching, a technique initially applied to high-density, multi-layer NAND...
Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
October 27 marked the second anniversary of Jae-yong Lee's tenure as Samsung Electronics' (Samsung) executive chairman. However, both Lee and Samsung are facing unprecedented chall...
