Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung...
Samsung Electronics has reportedly delayed construction and equipment orders for its Pyeongtaek Phase 4 (P4) plant in South Korea and its second facility (T2) in Taylor, Texas. This...
Micron CEO Sanjay Mehrotra recently shared insights into the AI-powered PC market from a memory provider's perspective during the company's latest earnings call. He highlighted the...
South Korea's semiconductor stockpiles dwindled at the fastest clip since 2009 last month in a sign of sustained demand for high-performance memory chips used in artificial intelligence...
The explosive growth of artificial intelligence (AI) has fueled a surge in demand for data centers, with Micron projecting the high-bandwidth memory (HBM) market to surpass US$25...
Recent debates in the semiconductor industry have raised concerns about a potential oversupply of high bandwidth memory (HBM). Analysts believe a key factor will be whether Samsung...
Amid rising geopolitical tensions, the global semiconductor sector is witnessing an intense chip war across multiple regions, with a critical shortage of skilled talent emerging as...
The recovery in downstream consumer markets remains sluggish, leading to a further decline in spot market prices for memory chips. In response, industry leader Kingston Technology...
Thailand is set to make a significant stride in the semiconductor industry with the establishment of its first silicon carbide (SiC) wafer factory, which is expected to begin operation...
Despite AI-driven growth in the semiconductor industry, South Korea is facing a critical shortage of skilled workers. A preference among students for medical degrees and aggressive...
K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...
