China's aggressive automotive exports caught the world's attention, hitting a record high in the first half of 2024 but starting to slow down after tariffs imposed by Europe and the...
The third quarter of 2024 will see a gradual increase in the demand for industrial memory, and AI IPC applications specifically designed for the industrial control sector are expected...
Samsung Electronics has nearly doubled its NAND Flash production in the second quarter of 2024 after hitting a low point in the fourth quarter of 2023.
South Korean memory giants Samsung Electronics and SK Hynix, in addition to High Bandwidth Memory (HBM), will also start the competition in smartphone LPDDR DRAM stacking.
Semicon West 2024 was held on July 9-11 in San Francisco, and Tokyo Electron Limited (TEL), the Japanese semiconductor equipment supplier, unveiled the world's first open-source generative...
As the market for Thermo Compression Bonding (TCB) equipment diversifies, Semes, a subsidiary of Samsung Electronics and South Korea's leading semiconductor equipment manufacturer,...
DRAM and NAND flash memory prices will continue to rise in the third quarter, albeit at a slower rate than in the first half of this year, as market circumstances improve more, according...
Taiwan's memory module vendor Moment Semiconductor expects shipments for consumer devices to improve in the second half of 2024, driven by new applications like AI PCs.
Demand for High-Bandwidth Memory (HBM) and DDR5 RAM for servers has steadily risen as Cloud Service Providers (CSP) in North America continue building data centers, with IC distributor...
Samsung Electronics' HBM3E memory will soon obtain verification for volume shipments, potentially limiting the vendor's supply of DDR5 and other memory chips, according to industry...
The JEDEC Solid State Technology Association has announced that it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard.
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
Sanjay Mehrotra, CEO of US memory chip vendor Micron Technology, recently visited Taiwan accompanied by other senior executives from the company. During the tour, Mehrotra and Taiwan's...
Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing)...
