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Tuesday 9 July 2024
Computing clusters with at least 10,000 GPUs become basic requirement for Chinese Gen-AI LLMs

The keen competition of large-language models (LLMs) is pushing various Generative AI operators in China to find alternatives to achieve higher computing power without...

Tuesday 9 July 2024
SEMICON Taiwan 2024 to highlight AI as key driver of industry growth
As artificial intelligence (AI) continues to be a major driver of global semiconductor industry growth, SEMICON Taiwan 2024 is set to bring together industry leaders and visionaries...
Tuesday 9 July 2024
DRAM spot prices show promise, signs of stability
DRAM spot prices have stabilized, confirming the optimistic outlook for contract market pricing in the third quarter, according to sources at memory module makers. The previous variations...
Monday 8 July 2024
Samsung establishes HBM development team as first major change under new DS division head
Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth...
Monday 8 July 2024
TSMC's CoWoS innovator honored as Academia Sinica Academician in Taiwan
The 34th Academia Sinica academician and honorary academician election recently welcomed 28 new members, including Douglas Yu, Vice President of Pathfinding for System Integration...
Monday 8 July 2024
Global semiconductor sales climb 19% in May
The Semiconductor Industry Association (SIA) reported that global semiconductor industry sales reached $49.1 billion in May 2024, marking a 19.3% increase from $41.2 billion in May...
Monday 8 July 2024
Weekly news roundup: Qualcomm, MediaTek feel pressure from Huawei comeback, Micron cautions about over-capacity
These are the most-read DIGITIMES Asia stories in the week of July 1 – July 5.
Friday 5 July 2024
SK Hynix converts part of M10 production lines to produce HBM products
SK Hynix is reportedly converting part of its production line at its Icheon semiconductor plant in South Korea to manufacture high bandwidth memory (HBM) in response to rapidly increasing...
Friday 5 July 2024
Samsung expected to achieve 14-fold surge in operating income amid memory business recovery
Samsung Electronics is poised to report impressive results for the second quarter of 2024, driven by a recovery in the semiconductor industry. The company's operating profit surpassed...
Friday 5 July 2024
Samsung pivots to AI chip development amid major semiconductor division reorganization and talent acquisition drive
Samsung Electronics is reportedly shifting its focus from automotive chip development to AI chips amid plans for significant business reorganization. This strategic pivot comes as...
Friday 5 July 2024
Micron reaffirms full order book for HBM through 2025
A Micron senior executive said the company is expected to see full capacity through 2025 thanks to AI and Micron will keep up good management to ensure supply-demand balance amid...
Thursday 4 July 2024
Prices for commodity DRAM and NAND chips stall as demand recovery lags
The prices for general-purpose DRAM and NAND flash chips have remained flat for four consecutive months, suggesting a slower-than-expected pace of demand recovery.
Thursday 4 July 2024
Winbond looking to capitalize on edge AI opportunities
Taiwan-based niche semiconductor firms have mostly focused on opportunities in edge AI during the current AI boom. In particular, Winbond Electronics specializes in customized memory...
Wednesday 3 July 2024
Global demand's 18x growth for semiconductor talent outpaces Taiwan's supply: Burn-Jeng Lin
Despite increasing numbers of graduates from electrical engineering, electronics, and optoelectronics programs trained by six universities joining the industry, Taiwan still faces...
Wednesday 3 July 2024
Winbond chairman anticipates memory market rebound in 2H24
Winbond Electronics Chairman Arthur Yu-Cheng Chiao expressed optimism about the memory market, indicating that the second half of 2024 will enter an upward cycle extending into 202...