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    NEWS TAGGED MEMORY CHIPS
    Friday 25 April 2025
    China's Montage Technology storms into global DDR5 top three as AI chip demand explodes

    Montage Technology reported robust first-quarter 2025 results, with revenue climbing 65.78% year-over-year to CNY1.222 billion (approx...

    Friday 25 April 2025
    Exclusive: Google considers HBM3E supplier change
    Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification...
    Friday 25 April 2025
    JEDEC bends rules—Samsung, SK Hynix charge ahead in AI memory war
    JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...
    Friday 25 April 2025
    Tariffs shadow over NAND: Phison turns cautious, prices rise
    In response to potential tariff changes, Taiwanese companies in the industrial computer (IPC) sector are adjusting their strategies. As the US introduced a 90-day tariff exemption...
    Thursday 24 April 2025
    Sk Hynix completes validation for CXL-based DRAM module, boosting server capacity
    SK Hynix has completed customer validation for its 96GB Compute Express Link (CXL) Memory Module, a DRAM solution that has attracted significant industry attention for its potential...
    Wednesday 23 April 2025
    Hanmi reshapes South Korea's HBM arena, eyes Samsung alliance as SK Hynix ties fray
    The South Korean semiconductor industry is abuzz with intrigue as Hanmi Semiconductor's once-ironclad relationship with SK Hynix frays over the supply of thermal compression bonders...
    Tuesday 22 April 2025
    Hanmi Semiconductor's tough stance against SK Hynix supported by large TC bonder order from Micron
    South Korean media outlets have reported that Hanmi Semiconductor has received additional orders for thermo-compression bonding (TCB) equipment from Micron Technology. Some industry...
    Tuesday 22 April 2025
    Samsung to end DDR4 module production by 2025
    Samsung Electronics is accelerating the industry's transition away from DDR4 memory, having informed PC manufacturers that it will discontinue DDR4 modules by the end of 2025, with...
    Monday 21 April 2025
    Samsung lifts HBM yield as US tariffs loom over China-made chips
    South Korean media have reported that Samsung Electronics has made notable progress in developing next-generation high-bandwidth memory (HBM). According to Chosun Biz, the...
    Monday 21 April 2025
    Samsung faces delays in 1c DRAM development, raising concerns over HBM4 timeline

    Samsung Electronics is encountering delays in the development of its next-generation 1c DRAM chips, according to sources familiar with...

    Monday 21 April 2025
    China's CXMT muscles into DRAM's top tier—Is 'Big Three' era over?
    Forecasts suggest ChangXin Memory Technologies (CXMT), China's leading DRAM supplier, will dramatically expand its output in 2025—far surpassing previous expectations. If current...
    Monday 21 April 2025
    IC distributor Supreme reports sharp rise in orders as us tariffs trigger stockpiling
    Supreme Electronics, a Taiwan-based IC distributor, is seeing a significant uptick in customer demand and price levels as US tariff policies prompt inventory stockpiling across global...
    Monday 21 April 2025
    Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

    As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging...

    Saturday 19 April 2025
    Huawei's AI ambitions face energy efficiency test

    Huawei's CloudMatrix 384 (CM384) is making waves as the most ambitious AI hardware rollout in China to date—a rack-scale system powered...

    Saturday 19 April 2025
    JEDEC rolls out HBM4 standard: 2TB/s memory poised to supercharge AI, HPC
    The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards...
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    Research Report Database
    BIZ FOCUS
    Apr 17, 09:56
    Fingernail-sized, 2TB expansion in seconds – BIWIN Mini SSD unleashes the potential of ultrabooks
    Wednesday 16 April 2025
    Hilscher: Pioneering industrial communication solutions for industry 4.0 and beyond
    Wednesday 16 April 2025
    TCL CSOT showcases electronic paper display solutions at TouchTaiwan 2025
    Tuesday 15 April 2025
    7 advantages of GPU overclocking
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES