Towa, a prominent name in Japan's semiconductor manufacturing equipment industry, has introduced a new technology specifically designed for the sixth-generation high bandwidth memory...

The memory market has shown signs of stabilization after a notable downturn, with recent price increases indicating a positive shift. This transition comes in the wake of manufacturers...

Samsung Electronics Chairman Lee Jae-yong was recently joined by senior executives from the company's semiconductor and display departments on a rare visit to China. Industry analysts...

Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...

Samsung Electronics Chairman Lee Jae-yong recently made a high-profile visit to China, meeting with leading Chinese automaker executives and President Xi Jinping. South Korean analysts...

Hiroshi Kawamoto, Division Officer, Finance Division of Tokyo Electron Limited (TEL), one of Japan's leading semiconductor equipment manufacturers, projects that demand for high-bandwidth...

Hanwha Semitech is poised to expand its supply of thermal compression bonding machines (TCB) for high-bandwidth memory (HBM) production to SK Hynix.

Following the announcement of a price increase by Micron, the world's third-largest DRAM manufacturer, South Korean media analysis indicates that the other two major DRAM players,...

These are the most-read DIGITIMES Asia stories from the week of March 24 – March 29.

A recent survey from South Korea reveals a significant boost in the country's top 500 companies' performance in 2024. Operating profits soared by 66% compared to 2023, reaching KRW73...

Global investment in front-end fab equipment is projected to increase by 2% year over year to US$110 billion in 2025, marking the sixth consecutive year of growth since 2020, according...

SK Hynix announced during its 77th shareholders' meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak...

Silicon Motion Technology has entered the AI humanoid robotics supply chain and anticipates substantial growth from this area over the next five years, according to the flash device...

SK Hynix has completed the full acquisition of Intel's NAND Flash division, concluding a four-year process. The assets will be integrated under Solidigm, SK Hynix's US subsidiary,...

Phison Electronics is accelerating its AI push through key partnerships, most notably with Ever Fortune.AI Co. The two companies have launched a joint venture, Chang Lian Technology,...