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NEWS TAGGED DRAM
Thursday 9 May 2024
Samsung designates separate teams for HBM3E and HBM4 development, targeting HBM market supremacy
Samsung Electronics reportedly plans to dedicate separate development teams for next-generation High Bandwidth Memory (HBM) products, HBM3E and HBM4, to strengthen its competitiveness...
Wednesday 8 May 2024
AI server demand fuels DRAM titans battle over HBM
The surging of AI servers has skyrocketed the demand for High-Bandwidth Memory (HBM).
Tuesday 7 May 2024
Samsung said to consider Inpria's metal oxide resist for 1c DRAM process
Samsung Electronics reportedly intends to use metal oxide resist in the Extreme Ultraviolet (EUV) exposure process of new generation DRAM products. Metal oxide resist belongs to the...
Tuesday 7 May 2024
DRAM and NAND flash prices unlikely to fall over next 2 quarters, says Team Group exec
DRAM and NAND flash prices are unlikely to trend downward in the next two quarters, according to Gerry Chen, president of memory module company Team Group.
Monday 6 May 2024
SK Hynix denies plan to produce DRAM at M17 site
SK Hynix reportedly designated its M17 factory site as another new DRAM production base soon after announcing in late April its investment in the M15X DRAM plant in Cheongiu, South...
Monday 6 May 2024
Winbond stays in the red, to raise funds for improvements
Winbond Electronics, a manufacturer of specialty DRAM and flash memory, sustained operating losses throughout the first quarter of 2024, including a NT$464 million (US$14.4 million)...
Thursday 2 May 2024
Micron shipping critical memory for AI data centers
Micron Technology announced that it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory at speeds of up to...
Friday 26 April 2024
AI PCs to boost QLC NAND SSD adoption, says Micron
The current adoption rate of QLC NAND SSD in PCs is approximately 20-25%, and this rate is expected to expand dramatically in 2024, according to Micron Technology. The primary use...
Friday 26 April 2024
Micron granted US$6.1 billion in US subsidies
The US Department of Commerce and Micron Technology have signed a non-binding Preliminary Memorandum of Terms (PMT) to provide up to US$6.14 billion in direct funding under the CHIPS...
Thursday 25 April 2024
SK Hynix selects Cheongju as new DRAM production base, investing KRW5.3 trillion
SK Hynix has announced plans to expand production capacity for next-generation DRAM, including HBM, a critical component of AI infrastructure. This decision is in response to the...
Wednesday 24 April 2024
Micron to step up AI memory fabs construction in US after securing gov't grants
American memory chip giant Micron Technology, which has not built a new fab in the US for 20 years, is expected to step up its construction of new manufacturing facilities in New...
Wednesday 17 April 2024
Winbond on track for growth as PC application demand resumes
Winbond Electronics, a maker of specialty DRAM and flash memory, will see its main products be on track for growth, according to industry sources.
Tuesday 16 April 2024
Memory chipmakers keep raising prices but some module houses refuse to buy
Memory chipmakers are bent on raising prices, but memory module manufacturers who are unwilling to accept price increases are refusing to buy, according to industry sources.
Monday 15 April 2024
Weekly news roundup: JCET has offered advanced packaging services for chips below 5nm, the company says
These are the most-read DIGITIMES Asia stories in the week of April 8 - April 12.
Friday 12 April 2024
SK Hynix said to mass produce 10nm 1c DRAM in 3Q24, ahead of Samsung
SK Hynix reportedly is slated to start mass production of the sixth-generation 10nm 1c DRAM in the third quarter of 2024, ahead of Samsung's schedule, drawing significant attention...