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NEWS TAGGED CHIPBOND
Wednesday 6 September 2017
Chipbond 3Q17 revenues to hit record high
Chipbond Technology, a backend house specializing in LCD driver ICs, is expected to see its third-quarter revenues climb to an all-time high, according to market watchers.
Friday 25 August 2017
Chipbond, ChipMOS see rising orders for TDDI chips
Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...
Monday 14 August 2017
Chipbond posts record July revenues
Chipbond Technology, a backend house specializing in LCD driver ICs, saw its July revenues climb to a record high of NT$1.63 billion (US$53.9 million).
Wednesday 19 July 2017
Chipbond reportedly to sell partial stake in China subsidiary to BOE
Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...
Wednesday 19 July 2017
Chipbond, ChipMOS seeing robust gold bumping demand
Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...
Wednesday 12 July 2017
Taiwan IC backend firms revenues to peak for 2017 starting August, September
Taiwan-based IC backend houses, particularly those engaged in the supply chain for Apple's upcoming iPhones, are expected to see their revenues start peaking for 2017 in August or...
Tuesday 4 July 2017
Taiwan backend firms gearing up for robust demand for TDDI chips
Demand for TDDI (touch with display driver integration) chips is set to boom starting the third quarter of 2017 which will buoy sales at related backend companies including Chipbond...
Monday 19 June 2017
Chipbond to see revenues peak in 3Q17
Chipbond Technology, a backend house specializing in LCD driver ICs, is expected to see its third-quarter revenues peak for 2017 driven by a pull-in of orders from Japan-based clients,...
Tuesday 30 May 2017
JMC optimistic about full-screen OLED phone demand
JMC Electronics, an affiliate of Chang Wah Electromaterials (CWE) specializing in the manufacture of chip-on-film (COF) substrates, has expressed optimism about demand for smartphones...
Wednesday 1 March 2017
Chipbond net profits fall to 5-year low
LCD driver IC backend specialist Chipbond Technology saw its net profits fall to a five-year low of NT$1.99 billion (US$64.7 million) in 2016.
Tuesday 10 January 2017
Chipbond posts record December, 4Q16 revenues
Chipbond Technology saw its December revenues climb to a record NT$1.63 billion (US$50.8 million). Revenues for the fourth quarter of 2016 came to NT$4.87 billion, also a record hi...
Monday 26 December 2016
Chipbond grabs new gold bumping orders for power amplifiers, says report
Packaging and testing house Chipbond Technology reportedly has landed new orders for gold bumping for power amplifier (PA) components from Japan- and US-based vendors, according to...
Friday 23 December 2016
AUO, Novatek, Chipbond to benefit from Sharp decision to stop supplying panels to Samsung, says report
Taiwan flat panel maker AU Optronics (AUO), LCD driver IC supplier Novatek Microelectronics and driver IC packaging firm Chipbond Technology will benefit from Sharp's decision to...
Thursday 8 December 2016
Chipbond set to report record 4Q16 revenues
Packaging and testing company Chipbond Technology has reported consolidated revenues of NT$1.63 billion (US$51.3 million) for November 2016, hitting a monthly record for the third...
Friday 11 November 2016
Chipbond posts another month of record revenues
Packaging and testing company Chipbond Technology has reported consolidated revenues of NT$1.62 billion (US$51.1 million) for October 2016, up 0.5% sequentially and 14.1% on year.
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research