Sigurd Microelectronics, which specializes in wafer probing and final testing of ICs, expects to enjoy growing revenue generated from orders for automotive chips including networking...
Eyeing robust demand for high-speed and high-frequency device applications, CCL makers in Taiwan and China are set to step up equipment and facility purchases for capacity expansions,...
Niching Industrial with its in-house developed low-temperature sintering Ag paste materials has cut into China's third-generation semiconductor industry supply chain, according to...
Eternal Materials, which specializes in resin materials and dry-film photoresists, continues to enjoy strong shipments for high-frequency and high-speed substrates, while seeing orders...
Shortage of automotive MCUs will remain on track to ease in 2022, but a new wave of uneven component supply will be emerging and may last till 2023 with core chips for ADAS to lead...
Taiwan-based Nan Ya PCB is optimistic that its 2022 revenues will register another double-digit growth on new ABF and BT production capacities gradually coming online.
TSMC is set to enjoy robust demand for HPC processors in the data-driven world of 5G, AI and the metaverse, as the foundry's advanced sub-7nm process manufacturing attracts orders...
Nan Ya PCB has disclosed plans to invest NT$8.4 billion (US$302.9 million) in building additional ABF substrate production lines at its factory site in Shulin, New Taipei.
Taiwan-based Nan Ya Plastics has reported its October revenues grew 4.9% sequentially and 51.4% on year reaching a record monthly high of NT$37.45 billion (US$1.343 billion).
Rising demand for 5G handset application processors, RF chips and HPC solutions boosted revenue at IC test solutions provider Chunghwa Precision Test Tech (CHPT) in October 2021,...
The shortage of ABF substrates is worsening further as demand continues to grow at a faster pace than expected, and the supply crunch will persist throughout 2023 and may even last...
As chipmakers continue to ramp up production of large-size HPC chips to meet the ever-rising requirements for computing power, IC substrate makers are all stepping up capacity expansion...
ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...
TSMC's newly-developed system-on-integrated-chips (SoIC) technology will be first adopted for AMD's multiple high-performance computing (HPC) chip series, according to industry sou...
