Czech microscopy equipment supplier Tescan is continuing to deepen its presence in the Asia-Pacific market, targeting growing opportunities in semiconductor failure analysis (FA)....
Riding a semiconductor industry recovery and AI-driven demand for advanced packaging, Taiwan Mask Corporation (TMC) President Lidon Chen said the company expects significant and substantial...
Eternal Materials expects operations in 2026 to outperform 2025, driven primarily by growth in precision equipment and scaling shipments of semiconductor advanced packaging materials...
Tescan's expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis...
Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...
Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC)...
Intel's advanced packaging complex in Malaysia is expected to begin operations later this year, Prime Minister Datuk Seri Anwar Ibrahim said, as the company advances its assembly and...
The global race to onshore semiconductor production has a new focal point: Hwaseong. Nestled in South Korea's Gyeonggi-do province, the city is quietly emerging as the spine of the...
Japanese semiconductor maker Rohm is expanding its engagement with India's nascent semiconductor manufacturing ecosystem, positioning the country as a potential future export base...
At GTC 2026, Nvidia CEO Jensen Huang delivered a blunt message to an industry fixated on raw compute: the next bottleneck in AI is not the chip — it is everything around it....
Display driver IC (DDIC) packaging leader Chipbond outlined three key growth drivers at its recent earnings call that are expected to support its core driver IC business despite industry...
