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NEWS TAGGED PACKAGING
Thursday 4 June 2026
Interview: Andhra Pradesh moves to become India's semiconductor packaging hub
Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of...
Thursday 4 June 2026
Huawei's Tau Law exposes China's EDA gap; Empyrean advances memory chip design tools
Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal...
Wednesday 3 June 2026
MediaTek denies rumored EMIB adoption timeline
MediaTek denied a foreign report about a timeline for adopting Intel Corp.'s embedded multi-die interconnect bridge packaging at a recent investor event and said its supply-chain strategy...
Wednesday 3 June 2026
Analysis: New AI race is redefining semiconductor industry at Computex
Computex 2026 showcased the industry's latest innovations with its usual fanfare. Yet beneath the spectacle, the event revealed something far more consequential: artificial intelligence...
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level...
Tuesday 2 June 2026
Samsung signals broader AI memory deployment with HBM5 roadmap and thermal tech
Samsung Electronics has used Computex 2026 to outline a broader AI memory strategy, highlighting HBM5, thermal management, and advanced packaging as it prepares for next-generation...
Tuesday 2 June 2026
TSMC races to expand AI chip capacity while CPO and CoWoS move to center stage
Nvidia GTC Taipei opened on June 1 with a packed keynote by CEO Jensen Huang, who kicked off the event by unveiling the widely watched Taiwan supply chain board.
Tuesday 2 June 2026
KYEC chair CK Lee steps down; vice chair Chi-chun Hsieh takes over
Semiconductor testing company King Yuan Electronics (KYEC) recently convened its 2026 shareholders' meeting, during which it completed the election of nine board directors. Longtime...
Tuesday 2 June 2026
Commentary: Intel turns AI packaging crunch into foundry comeback test
Intel's foundry revival may depend less on beating TSMC at the most advanced process nodes than on whether it can turn AI-driven demand into a profitable advanced packaging busines...
Tuesday 2 June 2026
Analysis: Advanced packaging shifts from TSMC dominance to industry collaboration
Nvidia CEO Jensen Huang has repeatedly backed TSMC's price hikes, saying its advanced process and supply-chain services are difficult and highly valuable. As AI chip demand surges,...
Monday 1 June 2026
Foxconn expands France push with Tessalia chip-packaging venture, Bull AI project

Foxconn is expanding its footprint in France through two projects spanning artificial intelligence infrastructure and semiconductor packaging,...

Monday 1 June 2026
Exclusive: TSMC SoIC deepens AI chipmaker lock-in while Huawei hits process wall
The global semiconductor industry is at an inflection point, split between those who can still shrink transistors and those who can no longer do so. US export controls and the denial...
Monday 1 June 2026
MediaTek highlights supply chain advantage, says focus with Nvidia is product cooperation
MediaTek held a pre-Computex 2026 media event in Taipei, Taiwan, on May 29, after which president and COO Joe Chen and CFO and co-COO David Ku spoke with reporters. Ku shared his views...
Monday 1 June 2026
AuthenX targets CPO bottlenecks with detachable metalens FAU
AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...