China's IC industry output value grew 20.8% from a year earlier to CNY115.29 billion (US$18.1 billion) in the first quarter of 2018, according to statistics released by the China...

Samsung Electronics has disclosed its comprehensive process technology roadmap updates down to 3nm at the annual Samsung Foundry Forum in the US.

Lagging behind Taiwan Semiconductor Manufacturing Company (TSMC) in the development of fan-out wafer level packaging (FOWLP) technology, Taiwan's main OSAT (outsourced semiconductor...

Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for power management ICs from MediaTek, according to industry sources.

Memory-IC backend specialist Powertech Technology (PTI) has reported consolidated revenues of NT$5.58 billion (US$186.2 million) for April 2018, up 27.9% on year but down 1.3% sequ...

Taiwan's leading IC backend house Advanced Semiconductor Engineering (ASE) expects its revenues for the second quarter of 2018 to grow 6-9% sequentially and on year on strong market...

Panel level packaging (PLP) is expected to reach a market scale of US$285 million by 2023, showing a 51% CAGR during the 2017-2023 period, according to Yole Developpement.

With its large foundry and advanced packaging base, Taiwan was the largest consumer of semiconductor materials for the eighth consecutive year in 2017, according to a recent SEMI...

IC packaging specialist Siliconware Precision Industries (SPIL) has reported net profits of NT$240 million (US$8.1 million) for the first quarter of 2018, down 83.9% sequentially...

Backend house Powertech Technology (PTI) has seen its order visibility extend to the third quarter of 2018, but expressed concerns that tight supplies of certain components and materials...

Taiwan OSAT (outsourced semiconductor assembly and test) firms are facing headwinds in striving for flip-chip packaging orders for cryptocurrency mining ASICs, as the sharp price...

The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...

IC packager Siliconware Precision Industries (SPIL) disclosed on April 16 that production subsidiary Siliconware Electronics (Fujian) has struck a deal with China MCC20 Group for...

Taiwan-based logic IC packaging firm Greatek Electronics, an affiliate of Powertech Technology (PTI), has seen orders for MCUs ramp up from its IDM clients while enjoying strong demand...

Memory-IC backend specialist Powertech Technology (PTI) has announced consolidated revenues of NT$5.65 billion (US$193.5 million) for March 2018, up 16% sequentially and 32.4% on...

Worldwide sales of semiconductor manufacturing equipment totaled US$56.6 billion in 2017, a year-over-year increase of 37% from 2016 sales of US$41.24 billion, according to SEMI....

Fueled by heavy government investment, IC packaging and testing in China generated US$29 billion in revenues in 2017, making China the world's largest consumer of packaging equipment...

Advanced Semiconductor Engineering (ASE), a provider of semiconductor assembly and test services, on April 3 held a groundbreaking ceremony at the site of its K25 building in the...

The InFO WLP (integrated fan-out wafer level packaging) and CoWoS (chip on wafer on substrate) developed by Taiwan Semiconductor Manufacturing Company (TSMC) have emerged as two major...

Automated optical inspection (AOI) equipment specialists Utechzone and Machvision are being pinpointed by market observers as the beneficiaries of semiconductor and LCD panel makers'...

Taiwan-based leadframe suppliers plan to raise their prices 10-15% in the second quarter of 2018 to reflect tight supply, according to sources at IC backend houses.

Major IC packaging and testing players are actively developing an advanced fan-out panel level packaging (FOPLP) technology that can package chips on panels larger than 8-inch or...

IC packaging material and tool distributor Niching Industrial saw its gross margin reach a record high of 23% in the fourth quarter of 2017. Gross margin for all of 2017 climbed to...

Taiwan-based GEM Services, a backend house dedicated to MOSEFET chips and power modules, plans to expand monthly production capacity at its plant in Hefei, China by 30-50% to better...

Computing device ODMs are in talks with their customers about raising their contract quotes to reflect rising materials costs, according to Compal Electronics president Ray Chen.