News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 28 August 2026

AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

Friday 28 August 2026

Samsung eyes zHBM products from 2029 as heat remains key hurdle

Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...

Friday 28 August 2026

Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production

Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...

Friday 28 August 2026

Exclusive: IC design faces wire bonding bottleneck in 2027

Surging AI chip demand continues to outstrip TSMC's advanced packaging capacity. At the same time, massive AI server shipments are driving up demand for CPUs, networking equipment,...

Friday 28 August 2026

SK Hynix breaks ground on US$4 billion Indiana plant that will package, not make, HBM

SK hynix broke ground on August 27 on a US$4 billion advanced packaging plant in Purdue Research Park, its first US high-bandwidth memory (HBM) site.

Thursday 27 August 2026

HBM hybrid bonding delayed by 300°C heat and CMP dishing

As high-bandwidth memory (HBM) stack counts continue to rise, the industry originally anticipated that hybrid bonding (HB), a next-generation packaging solution, would be officially...

Thursday 27 August 2026

SK Hynix questions PIM as thermal, packaging limits constrain HBM

South Korean memory rivals Samsung Electronics and SK Hynix are taking fundamentally different routes to solve HBM performance bottlenecks. While Samsung frames processing-in-memory...

Thursday 27 August 2026

AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp

Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...

Thursday 27 August 2026

Google, MediaTek embrace advanced packaging diversification

Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...

Thursday 27 August 2026

India's CG Power targets 70% utilization at larger semiconductor packaging plant

CG Power and Industrial Solutions is targeting 70% utilization at its larger semiconductor packaging facility within about four years, with the unit potentially generating around US$500...

Thursday 27 August 2026

HTSI targets AI chip demand with SiPh, CPO, packaging push

Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...

Thursday 27 August 2026

Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

Thursday 27 August 2026

Samsung Galaxy A1 DDI packaging shifts to Chipbond

Rising gold prices are squeezing Samsung Electronics' entry-level smartphone supply chain, with South Korean media reporting that back-end packaging and testing orders for display...

Thursday 27 August 2026

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At...

Thursday 27 August 2026

Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging

Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...

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Aug 27, 08:00

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

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