Amid mounting tariff pressures and geopolitical risks, the Taiwan Printed Circuit Association (TPCA) announced that it will showcase a Taiwan advanced packaging zone at Apex Expo 2026,...
The latest global ranking of the top 10 outsourced semiconductor assembly and test (OSAT) providers points to a shift in competitive balance. In 2025, five Chinese companies entered...
The microcontroller unit (MCU) sector has emerged from inventory destocking in 2025, with the easing of US-China tariff tensions signaling a market recovery. Industry insiders expect...
Xintec, the packaging and testing subsidiary of TSMC, held an investor conference in which Chairman CH Chen said full-year 2025 revenue maintained modest growth, driven primarily by...
Taiwan-based AblePrint Technology, a key supplier of advanced packaging defoaming equipment for major clients including TSMC, reported record-breaking performance despite earlier regulatory...
Tongtai Machine & Tool has launched a transformation to shift from traditional equipment manufacturing to providing integrated process and system solutions, targeting AI server,...
Surging demand for artificial intelligence servers and high-performance computing (HPC) has tightened capacity across the semiconductor supply chain. For many small South Korean communications...
AUO is overhauling its business model to make Vertical Solution and Mobility Solution the dominant revenue sources, targeting a combined 70% share of sales by 2030 while expanding...
Amkor Technology is accelerating its transition into the next wave of advanced packaging growth, focusing on high-performance computing (HPC) and artificial intelligence (AI). This...
China-based foundry SMIC will release fourth-quarter 2025 results on February 10 and hold its first 2026 investor briefing on February 11. Market focus is expected to center on its...
Amkor Technology is accelerating its global expansion, projecting 2026 capex between US$2.5 billion and US$3 billion. This plan emphasizes significant facility construction, including...
On February 9, Amkor Technology reported solid financial performance for both the fourth quarter and full year 2025, supported by record revenue from advanced packaging and computing...
TSMC chairman C.C. Wei recently visited Japan and appeared alongside Prime Minister Sanae Takaichi to jointly announce that Kumamoto Fab 2 will be upgraded from a 6nm to a 3nm process,...
China's semiconductor investment is once again converging in Wuhan. YMTC's Phase III fab has entered an intensive equipment installation phase, with key process tools steadily moving...
TSMC has made a significant change in its process plan for the Kumamoto second fab, confirming an upgrade from the initially planned 6/7nm node to 3nm. This facility will become Japan's...
