At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan...

LCY Advanced Materials unveiled a new wet chemical solution for next-generation high-density interconnects at the SEMICON Taiwan 2026 Heterogeneous Integration International Summit,...

As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...

TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...

TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...

Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after...

Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at SEMICON Taiwan...

Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...

AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...

Taiwan's semiconductor materials suppliers are seeking gains from square packaging and co-packaged optics as advanced manufacturing evolves. The changes could help local firms move...

Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...

Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...

Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...

On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...