The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that...
TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
The first quarter of 2026 has marked a decisive shift in how Taiwan's semiconductor equipment sector is valued. While February's accumulated revenue rankings continue to reflect the...
The semiconductor industry has formally entered the Foundry 2.0 era, a phase defined by the deep integration of manufacturing, assembly, and testing, profitably driven by the global...
Samsung Electronics plans to mass-produce silicon photonics starting from 2028, a move that could reshape global data-center networking, AI hardware integration, and foundry competition...
Samsung Electronics is aggressively pushing its semiconductor "super-gap" core strategy centered on a turnkey solution model. However, the success of this approach hinges on restoring...
C SUN and Contrel have announced a significant equity partnership, as C SUN agreed to invest approximately NT$1.02 billion (approx. US$32 million) as a strategic investor to acquire...
Innolux is selling multiple factories to strengthen its financial position and operations. Following an announcement of a standard factory sale to ChipMOS, Innolux disclosed on March...
AI computing is pushing the semiconductor industry into a structural growth phase, reshaping global capacity and technology pathways, according to Lily Feng, President of SEMI China,...
Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications...
SEMICON China 2026 opened on March 25 in Shanghai, as the global semiconductor industry enters a new expansion cycle fueled by the rapid rise of artificial intelligence.
As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
