Amkor Technology is accelerating its transition into the next wave of advanced packaging growth, focusing on high-performance computing (HPC) and artificial intelligence (AI). This...
China-based foundry SMIC will release fourth-quarter 2025 results on February 10 and hold its first 2026 investor briefing on February 11. Market focus is expected to center on its...
Amkor Technology is accelerating its global expansion, projecting 2026 capex between US$2.5 billion and US$3 billion. This plan emphasizes significant facility construction, including...
On February 9, Amkor Technology reported solid financial performance for both the fourth quarter and full year 2025, supported by record revenue from advanced packaging and computing...
TSMC chairman C.C. Wei recently visited Japan and appeared alongside Prime Minister Sanae Takaichi to jointly announce that Kumamoto Fab 2 will be upgraded from a 6nm to a 3nm process,...
China's semiconductor investment is once again converging in Wuhan. YMTC's Phase III fab has entered an intensive equipment installation phase, with key process tools steadily moving...
TSMC has made a significant change in its process plan for the Kumamoto second fab, confirming an upgrade from the initially planned 6/7nm node to 3nm. This facility will become Japan's...
OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting from the short supply of advanced packaging and testing capacity...
Given frequent price increases across precious metals, wafer foundry services, and packaging and testing, Infineon's announcement of price increases is very telling for the market...
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding held its earnings call, revealing that robust demand for advanced semiconductor packaging services...
Amid rising wafer fab and raw material costs, Chinese MCU maker Cmsemicon led a 15-50% price increase to curb losses in the sluggish MCU market. Despite packaging firms signaling price...
As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation...
Texas Instruments (TI), Infineon Technologies AG, STMicroelectronics, and NXP Semiconductors are expanding their manufacturing footprint in Malaysia as global customers accelerate...
Samsung Electronics and SK Hynix have both secured production-ready technology for 16-layer stacks of sixth-generation high-bandwidth memory, known as HBM4, positioning the two South...
Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid...
