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NEWS TAGGED PACKAGING
Monday 11 May 2026
DIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test

DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet...

Monday 11 May 2026
Chinese semiconductor suppliers expand SEA presence at SEMICON SEA 2026
At SEMICON Southeast Asia 2026 in Kuala Lumpur, China's semiconductor equipment makers are steadily "infiltrating" the Southeast Asian market, extending from back-end packaging and...
Monday 11 May 2026
ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029
Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler...
Monday 11 May 2026
AI boom drives Taiwan's semiconductor testing industry into record expansion

To secure a foothold in the booming market for advanced AI chip packaging and testing, Taiwan's outsourced semiconductor assembly and test...

Monday 11 May 2026
Weekly news roundup: Taiwan freezes trading in MediaTek; 2D NAND shortage spirals
Below are the most-read DIGITIMES Asia stories from the week of May 4-10, 2026:
Monday 11 May 2026
PCL Technologies to buy precision plastics and metal parts maker to target CPO components for data centers
PCL Technologies announced that its board approved a plan to acquire 100% of Pingood Group, including Pingood Enterprise Co., Pingood (Thailand) Co., Ltd., Pingji Electronics (Dongguan)...
Monday 11 May 2026
India roundup: India accelerates semiconductor and display ambitions with new approvals, AI infrastructure expansion

India is advancing its electronics and semiconductor manufacturing strategy through new approvals...

Friday 8 May 2026
TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead
TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to...
Friday 8 May 2026
Surging AI demand tightens supply of key PCB material

Demand for high-performance printed circuit boards (PCBs) used in advanced semiconductors has surged in recent months, tightening supply...

Friday 8 May 2026
Shenmao rides the AI infrastructure boom to record revenue growth
Taiwanese solder materials manufacturer Shenmao Technology said surging demand from the artificial-intelligence server supply chain, coupled with expanding shipments to Southeast Asia...
Friday 8 May 2026
TSMC eyes bigger US investment; Arizona chip expansion accelerates
Taiwan remained the largest foreign delegation at the US Department of Commerce's SelectUSA Investment Summit for a third straight year, with TSMC indicating it may further expand...
Thursday 7 May 2026
Chinese semiconductor equipment makers deepen SEA OSAT presence
Chinese semiconductor equipment makers CCtech and Nextool Technology are expanding into Southeast Asia's OSAT hubs as Malaysia and Singapore emerge as key packaging and testing centers...
Thursday 7 May 2026
Intel shifts data center chip packaging to Vietnam and expands EMIB advanced packaging integration
Intel is relocating a data center chip production line from Costa Rica to its Vietnam facility. The move, flagged in a Saigon Hi-Tech Park management board report to the Ho Chi Minh...
Thursday 7 May 2026
Intel targets entry-level advanced packaging, draws interest from Google and Amazon
Over the past decade, market assessments of Intel have largely been confined to a single lens: execution in advanced process technology. By that metric, Intel has struggled, with delays...
Wednesday 6 May 2026
Intel Capital leads QuantWare's US$178 million bet on hyperscale quantum computing ambitions
QuantWare's US$178 million Series B round aims to accelerate the global rollout of larger, industrial-scale quantum processors, promising hyperscale quantum compute through its VIO-40K...