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NEWS TAGGED PACKAGING
Friday 19 December 2025
Taiwan makes silicon photonics a pillar of its new national AI strategy

Taiwan is seeking to anchor itself at the center of the next wave of artificial intelligence infrastructure, with silicon photonics elevated...

Friday 19 December 2025
TSMC Co-COO Y.J. Mii wins Executive Yuan Award for driving advanced process and packaging innovation
TSMC Executive Vice President and Co-Chief Operating Officer Y.J. Mii has been awarded the Executive Yuan Award for Outstanding Science and Technology Contribution, underscoring both...
Friday 19 December 2025
Tata Group invests additional US$170M in Tata Electronics to expand iPhone production and semiconductor capacity
Tata Group has invested an additional INR15 billion (US$170 million) in Tata Electronics, the company that manufactures iPhones for Apple, bringing its total investment in the subsidiary...
Friday 19 December 2025
SK Hynix accelerates US$15B M15X expansion as equipment move-in kicks off
SK Hynix is accelerating the build-out of its M15X memory chip plant in Cheongju, South Korea, as the company installs manufacturing tools and moves into the final engineering phase...
Thursday 18 December 2025
Niching targets multi-year vapor chamber upswing, insulates margins against metal costs
Niching Industrial Corp., a supplier of semiconductor packaging and testing materials, said revenue in 2025 is likely to hit a record high, driven by rising cooling demand from AI...
Thursday 18 December 2025
Advanced packaging drives ABF substrate expansion as Taiwanese companies exit post-pandemic capacity cuts
As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers...
Thursday 18 December 2025
Apple reportedly explores chip assembly in India, signaling supply chain diversification
Apple is reportedly in preliminary talks with Indian chip manufacturers to assemble and package components for the iPhone, potentially marking a first step in shifting part of its...
Wednesday 17 December 2025
Taiwan academia advances E-band research for satellite communication applications
E-band wireless communication, operating between 71-76 GHz and 81-86 GHz, offers extremely high data throughput and ultra-low latency. Beyond its current use in automotive radar,...
Wednesday 17 December 2025
Tokyo Ohka ramps up South Korea investment for advanced chip materials

Tokyo Ohka Kogyo plans to accelerate investment in South Korea and expand production of materials critical to generative AI semiconductors,...

Tuesday 16 December 2025
China's chip resilience: Naura M&A, ACM's HBM push defy US export controls
Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US...
Monday 15 December 2025
TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers...
Monday 15 December 2025
Micron's DDR5 outsourcing ramp redraws memory packaging trajectories through 2026
Memory demand remains overheated and supply tight, driving upstream manufacturers to lift utilization while majors such as Micron pivot toward customized, higher value-added output...
Monday 15 December 2025
Samsung pushes new thermal packaging to win back Qualcomm and Apple

Samsung Electronics is positioning a proprietary thermal management technology for external clients as it seeks to reclaim foundry market...

Friday 12 December 2025
Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's vision
Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's...
Friday 12 December 2025
CPO tech and Taiwan player deployment

Introduction