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    Chinese smartphone shipments to fall below 600 million units in 2026, lowest level since 2021
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    NEWS TAGGED PACKAGING
    Thursday 23 April 2026
    TSMC to open Arizona packaging facility by 2029, signals caution on high-NA EUV
    TSMC is accelerating its advanced packaging expansion in the US while maintaining a conservative stance on next-generation lithography, as the company balances cost pressures, AI-driven...
    Thursday 23 April 2026
    Japan's LSTC launches optoelectronic advanced packaging project around Rapidus cluster
    Research on optoelectronic integration — referring to the application of optical communication technology to computing — is gaining momentum. Its semiconductor packaging...
    Thursday 23 April 2026
    Lam Research signals sustained AI-driven momentum as WFE outlook improves
    Lam Research delivered a strong start to 2026, with first-quarter 2026 results exceeding expectations and reinforcing confidence in a semiconductor upcycle increasingly shaped by artificial...
    Thursday 23 April 2026
    SK Hynix builds HBM packaging hub in Cheongju to expand AI memory capacity
    SK Hynix has broken ground on a large-scale advanced packaging facility in Cheongju Technopolis, underscoring how the battleground for AI semiconductors is shifting beyond wafer fabrication...
    Wednesday 22 April 2026
    SJSemi's blockbuster IPO reorders China's chip packaging landscape
    Shares of SJSemi surged on their trading debut on Shanghai's SSE STAR Market on Monday, underscoring investor enthusiasm for advanced chip packaging technologies as demand for artificial...
    Wednesday 22 April 2026
    Micron's Sanand ramp shifts India chip debate from milestone to manufacturing system
    Micron Technology's Sanand assembly, test, marking, and packaging plant has given India something it lacked until recently: a live semiconductor manufacturing operation with global...
    Monday 20 April 2026
    Odisha to break ground on India's first advanced 3D chip packaging unit
    Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous...
    Sunday 19 April 2026
    Corning leads glass substrate race as South Korea's KCC and LX Glass face steep challenges
    Glass core substrates, valued for their low dielectric loss and warpage reduction, are key to next-generation advanced semiconductor packaging. In South Korea, traditional glass makers...
    Sunday 19 April 2026
    ASE's CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries
    AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers...
    Friday 17 April 2026
    TSMC revises advanced process and packaging strategy
    TSMC chairman C.C. Wei emphasized persistent capacity shortages during the company's earnings call, noting that 3nm technology accounted for about 25% of first-quarter 2026 revenue...
    Friday 17 April 2026
    Taiwan's OSAT expansion could tighten global test capacity and raise costs
    Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter...
    Friday 17 April 2026
    Apple highlights record progress in recycled materials across products
    Apple has announced what it describes as its highest-ever use of recycled materials across its product lineup, underscoring continued efforts to reduce environmental impact and move...
    Friday 17 April 2026
    Tongfu Microelectronics profit jumps on AI chip packaging, AMD demand

    Tongfu Microelectronics posted strong 2025 results, supported by AI and automotive chip demand, while reinforcing its position in the...

    Friday 17 April 2026
    TSMC chairman C.C. Wei denies customer favoritism regarding tight 1Q26 capacity
    TSMC delivered an above-expectations financial performance in the first quarter of 2026 and remains optimistic about continued strong demand for advanced process technologies entering...
    Friday 17 April 2026
    With chip limits near, focus shifts to packaging and integration

    As the rise of artificial intelligence (AI) pushes semiconductor performance toward new limits, the industry is confronting a fundamental...

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    Research Report Database
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook