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Monday 14 July 2025
Keysight sees AI chip boom driving verification market growth
Keysight Technologies expects AI and 6G networks to fuel structural growth in the semiconductor verification market that will outpace industry capital expenditure increases, according...
Monday 14 July 2025
BOE pivots beyond displays to glass substrate packaging, perovskite solar
BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology...
Friday 11 July 2025
Malaysia's Penang eyes semiconductor upgrade as AI demand reshapes industry
Malaysia's Penang state, home to about 13% of global semiconductor assembly and testing capacity, is positioning itself to capture more advanced chip manufacturing as artificial intelligence...
Friday 11 July 2025
Niching sees stellar 2Q25 results from AI, HPC, and advanced packaging applications
Materials supplier Niching is aiming to hit record-high revenue this year after strong performance in the first half of 2025, boosted by continued growing demand in the AI, high performance...
Friday 11 July 2025
NXP plots wafer shift to China as new CEO joins push for local supply chain
Kurt Sievers, the CEO of Dutch semiconductor giant NXP Semiconductors, who is set to officially step down at the end of October 2025, recently visited Shanghai and met with the mayor...
Friday 11 July 2025
Advanced packaging crisis hits as Asahi Kasei halts PSPI supply
Risks continue emerging one after another as the supply shortage of essential advanced packaging materials from Japan's chemical giant Asahi Kasei continues to escalate.
Thursday 10 July 2025
China's EDA shakeup stalls as Empyrean nixes Xpeedic deal

Empyrean Technology, one of China's top electronic design automation (EDA) vendors, announced on July 9 that it has terminated its proposed...

Thursday 10 July 2025
TSMC's CoPoS spurs industry shift as AI chip packaging hits glass ceiling
The global supply of CoWoS, or Chip-on-Wafer-on-Substrate, is tightening as demand for high-performance computing chips in AI applications continues to surge. These chips are simultaneously...
Wednesday 9 July 2025
From copper to CoWoS: Douglas Yu retires from TSMC
Dr. Chen-Hua Douglas Yu, Vice President of Pathfinding for System Integration and the sole TSMC Distinguished Fellow, officially retired on July 8, 2025, closing a chapter in one...
Wednesday 9 July 2025
South Korea's Hana cracks TGV glass substrate market with eye on AI chip boom
Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling...
Wednesday 9 July 2025
T-Glass shortage chokes CoWoS substrate supply, Nittobo delays ramp-up
Since the end of 2024, a critical shortage of T-Glass has been disrupting the global supply chain for advanced chip packaging. This specialized glass fabric, prized for its low thermal...
Wednesday 9 July 2025
Intel halts in-house glass substrate development as Tan avoids 'R&D trap'
Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data...
Tuesday 8 July 2025
Beyond display: how JDI aims to reinvent itself for the AI age
Small-to-medium-size panel maker Japan Display (JDI), despite having suffered 11 consecutive years of losses, global layoffs, and the recent resignation of its former CEO Scott Callon,...
Monday 7 July 2025
Rising AI ASIC use drives surge in SLT chip testing; Market to grow 30% in 2026
As artificial intelligence fuels rapid growth in high-performance computing, it's also triggering a shift in how semiconductor chips are tested. Beyond leading AI GPU makers, major...
Friday 4 July 2025
SEMICON Taiwan 2025 to launch AI chip packaging alliance, highlighting advanced packaging and ecosystem resilience
SEMICON Taiwan 2025 is scheduled to take place from September 10 to 12 at the Taipei Nangang Exhibition Center, with a series of technical forums kicking off on September 8. A key...