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NEWS TAGGED PACKAGING
Monday 25 May 2026
Huawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies...

Monday 25 May 2026
Weekly news roundup: TSMC faces its first real rivals; Agibot claims 100% success rate in factory deployment
Below are the most-read DIGITIMES Asia stories from the week of May 18-24, 2026:
Monday 25 May 2026
India roundup: India accelerates chip ambitions, but ecosystem gaps remain a key challenge

India is advancing its technology and semiconductor ambitions through new fab projects, packaging...

Monday 25 May 2026
Embedded substrates draw AI chip interest as packaging turns strategic
Rising interest in embedded substrates among Nvidia, AMD, and Intel signals potential shifts in AI data‑center supply chains, as the technology promises improved signal integrity...
Saturday 23 May 2026
Jensen Huang lands in Taiwan, calls Vera Rubin biggest product ramp in computer history
Nvidia CEO Jensen Huang arrived in Taiwan on May 23 ahead of COMPUTEX, telling reporters that the company's next-generation AI server platform — codenamed Vera Rubin —...
Friday 22 May 2026
AMD's Lisa Su says memory is becoming another pressure point for AI chips

AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure...

Friday 22 May 2026
AMD's Lisa Su says AI demand is 'absolutely real' as CPUs return to focus

AMD CEO Lisa Su pushed back against concerns of an AI bubble on May 22, saying demand is "absolutely real" and that the industry remains...

Friday 22 May 2026
Amkor expands Arizona semiconductor packaging campus with additional 67 acres

Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through...

Friday 22 May 2026
AMD deepens China packaging alliance with TF-AMD expansion in Suzhou
AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics),...
Friday 22 May 2026
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce...
Friday 22 May 2026
AP Memory IPD enters Intel's EMIB supply chain, shipments set for 2Q26
Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products,...
Friday 22 May 2026
Samsung's quiet Taiwan play: Pairing memory with foundry to chip away at TSMC
Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at...
Friday 22 May 2026
AMD backs Taiwan EFB packaging chain to cut CoWoS reliance

AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while...

Friday 22 May 2026
Lam Research's Salzburg PLP center signals push toward panel production, but hurdles remain for large-scale adoption
Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers...
Friday 22 May 2026
TSMC supply chain material maker AMC rides AI packaging yield boom

Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has...