Tongtai Machine & Tool has launched a transformation to shift from traditional equipment manufacturing to providing integrated process and system solutions, targeting AI server,...
Surging demand for artificial intelligence servers and high-performance computing (HPC) has tightened capacity across the semiconductor supply chain. For many small South Korean communications...
AUO is overhauling its business model to make Vertical Solution and Mobility Solution the dominant revenue sources, targeting a combined 70% share of sales by 2030 while expanding...
Amkor Technology is accelerating its transition into the next wave of advanced packaging growth, focusing on high-performance computing (HPC) and artificial intelligence (AI). This...
China-based foundry SMIC will release fourth-quarter 2025 results on February 10 and hold its first 2026 investor briefing on February 11. Market focus is expected to center on its...
Amkor Technology is accelerating its global expansion, projecting 2026 capex between US$2.5 billion and US$3 billion. This plan emphasizes significant facility construction, including...
On February 9, Amkor Technology reported solid financial performance for both the fourth quarter and full year 2025, supported by record revenue from advanced packaging and computing...
TSMC chairman C.C. Wei recently visited Japan and appeared alongside Prime Minister Sanae Takaichi to jointly announce that Kumamoto Fab 2 will be upgraded from a 6nm to a 3nm process,...
China's semiconductor investment is once again converging in Wuhan. YMTC's Phase III fab has entered an intensive equipment installation phase, with key process tools steadily moving...
TSMC has made a significant change in its process plan for the Kumamoto second fab, confirming an upgrade from the initially planned 6/7nm node to 3nm. This facility will become Japan's...
OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting from the short supply of advanced packaging and testing capacity...
Given frequent price increases across precious metals, wafer foundry services, and packaging and testing, Infineon's announcement of price increases is very telling for the market...
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding held its earnings call, revealing that robust demand for advanced semiconductor packaging services...
Amid rising wafer fab and raw material costs, Chinese MCU maker Cmsemicon led a 15-50% price increase to curb losses in the sluggish MCU market. Despite packaging firms signaling price...
As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation...
