CONNECT WITH US
NEWS TAGGED PACKAGING
Wednesday 9 September 2026
SEMIFIVE begins HyperAccel chip production on Samsung 4nm as capacity tightens
SEMIFIVE has begun mass production of HyperAccel's data center inference accelerator using Samsung Foundry's 4nm process, marking the Korean custom-silicon company's first large-scale...
Wednesday 9 September 2026
Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

Wednesday 9 September 2026
Mature-node chip scramble may persist through 2028 as supply chain management becomes bargaining leverage
Capacity for advanced semiconductor processes and packaging remains tight, while mature-node chips required for AI-related peripheral applications are also facing mounting supply pressure...
Wednesday 9 September 2026
SDC, LGD target advanced glass packaging
As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the display industry's cross-sector transformation. Although South...
Wednesday 9 September 2026
LCD supply could tighten by 2028 as Taiwan sells its fabs to chipmakers
LCD panel supply could tighten around 2028 as Taiwan manufacturers exit the segment faster than expected, while China uses profits from LCD to ramp OLED investment. The shift is being...
Tuesday 8 September 2026
Ma-tek August revenue hits record, eyes U.S. FA, MA service in 2027
MA-tek, a semiconductor testing and analysis company, reported August revenue of NT$565 million, up 17.78% from a year earlier and marking a record high for the sixth straight month...
Tuesday 8 September 2026
US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
Tuesday 8 September 2026
ViTrox rides AI demand, expands Taiwan push as Malaysia semiconductor base grows
After several years away from SEMICON Taiwan, Malaysia-based inspection equipment maker ViTrox returned to the show this year and has already confirmed plans to exhibit again next...
Tuesday 8 September 2026
Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission
As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged...
Tuesday 8 September 2026
Innolux, AUO take display technology into AI chips with FOPLP, glass substrates, Micro LED CPO
AI demand is accelerating advanced packaging and high-speed optical interconnect development, pushing Taiwan display makers Innolux and AUO deeper into the semiconductor supply cha...
Tuesday 8 September 2026
Taiwan sets out 2027 plan to reinforce AI, chip leadership
Taiwan plans to deepen its role in global technology supply chains as demand for AI chips, advanced packaging, and memory tightens worldwide. A new policy agenda aims to bolster semiconductor...
Monday 7 September 2026
Inside UC San Diego's 'Made with Taiwan' push to train TSMC's future engineers, reinvent chip packaging
The largest engineering school on the US West Coast by enrollment is training engineers for Taiwan Semiconductor Manufacturing Co. (TSMC) and pioneering advanced 3D packaging desig...
Monday 7 September 2026
India frames its chip build-out as redundancy for the world, and Taiwan as its partner in building it
India's most senior semiconductor policymakers came to Taipei with an argument aimed squarely at the Taiwanese supply chain: the country's chip program is meant to add redundancy to...
Monday 7 September 2026
SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
Monday 7 September 2026
Wah Lee sees faster growth in 2027 as supply stays tight
Wah Lee Industrial expects growth to accelerate in 2027 as advanced packaging capacity comes online and foundries continue building overseas fabs, while tight supplies of semiconductor...