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    China's Nvidia rivals raise prices as HBM shortage bites
    8min ago
    Taiwan nuclear drill simulates drone attack, drawing on Ukraine war lessons
    40min ago
    NEWS TAGGED PACKAGING
    Thursday 10 September 2026
    Spirox TGV inspection capable of scanning entire substrate in 20 minutes
    As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
    Thursday 10 September 2026
    AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
    AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
    Thursday 10 September 2026
    SK Hynix says 3D DRAM will borrow from logic foundry playbook
    SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Thursday 10 September 2026
    Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
    AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
    Thursday 10 September 2026
    Hiwin supply deal with Semes points to deeper access in South Korea's memory equipment market
    Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment,...
    Thursday 10 September 2026
    Apple names 2nm node for the first time since 2024 — and raises prices on every iPhone it still sells
    Apple used its 2026 iPhone launch to do two things it had avoided for years: name the process node in its flagship chip, and raise the price of phones already on sale. Both moves point...
    Wednesday 9 September 2026
    Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

    Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

    Wednesday 9 September 2026
    Amkor expands Arizona chip campus with phase 2 plan
    Amkor Technology's latest Arizona expansion underscores how advanced packaging capacity is becoming a strategic issue for the US semiconductor supply chain. The larger campus aims...
    Wednesday 9 September 2026
    SEMIFIVE begins HyperAccel chip production on Samsung 4nm as capacity tightens
    SEMIFIVE has begun mass production of HyperAccel's data center inference accelerator using Samsung Foundry's 4nm process, marking the Korean custom-silicon company's first large-scale...
    Wednesday 9 September 2026
    Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

    WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

    Wednesday 9 September 2026
    Mature-node chip scramble may persist through 2028 as supply chain management becomes bargaining leverage
    Capacity for advanced semiconductor processes and packaging remains tight, while mature-node chips required for AI-related peripheral applications are also facing mounting supply pressure...
    Wednesday 9 September 2026
    SDC, LGD target advanced glass packaging
    As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the display industry's cross-sector transformation. Although South...
    Wednesday 9 September 2026
    LCD supply could tighten by 2028 as Taiwan sells its fabs to chipmakers
    LCD panel supply could tighten around 2028 as Taiwan manufacturers exit the segment faster than expected, while China uses profits from LCD to ramp OLED investment. The shift is being...
    Tuesday 8 September 2026
    Ma-tek August revenue hits record, eyes U.S. FA, MA service in 2027
    MA-tek, a semiconductor testing and analysis company, reported August revenue of NT$565 million, up 17.78% from a year earlier and marking a record high for the sixth straight month...
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    BIZ FOCUS
    Sep 10, 08:00
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    reportAIglasses