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    Nvidia's rapid AI iteration cycle strains supply chain partners
    12min ago
    Samsung's quiet Taiwan play: Pairing memory with foundry to chip away at TSMC
    20min ago
    AMD backs Taiwan EFB packaging chain to cut CoWoS reliance
    23min ago
    China telcos launch token billing, AI inference goes mass-market
    29min ago
    Kian-Shen sees electric bus orders surge as BMW battery box trials set for fourth quarter
    32min ago
    Analysis: Samsung deal prevents walkout but deepens internal rifts over compensation
    33min ago
    South Korea aims for 50% domestic defense semiconductor supply by 2029
    34min ago
    Auto cyber losses topped US$20 billion in 2025 as carmakers tighten defenses
    37min ago
    Hotai Motor to trial hydrogen buses and weighs US-made SUVs and pickups as revenue hits record
    41min ago
    Samsung reportedly shifts GaN strategy toward foundry as device business stalls
    May 21, 18:53
    Wuhan's optical valley bets big on AI with 12.8T module debut
    May 21, 18:53
    NEWS TAGGED PACKAGING
    Friday 22 May 2026
    Lam Research's Salzburg PLP center signals push toward panel production, but hurdles remain for large-scale adoption
    Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers...
    Friday 22 May 2026
    TSMC supply chain material maker AMC rides AI packaging yield boom

    Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has...

    Friday 22 May 2026
    BOE, Corning target glass substrates for AI chip packaging

    BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the...

    Friday 22 May 2026
    AMD deepens Taiwan supply chain ties with US$10B-plus push
    AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum...
    Friday 22 May 2026
    Lam Research launches PLP Center of Excellence, replacing wafers with panels
    Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology...
    Thursday 21 May 2026
    AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity
    AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
    Thursday 21 May 2026
    Five weak links India Semiconductor Mission 2.0 must fix
    India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can...
    Thursday 21 May 2026
    AI chip boom strains ABF substrate supply chain
    AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...
    Thursday 21 May 2026
    SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push
    SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the...
    Thursday 21 May 2026
    OSE targets AI server SMT growth as memory demand lifts outlook
    Orient Semiconductor Electronics (OSE) said that strong memory market demand is lifting its outlook and expanding its role in the memory supply chain, while also strengthening its...
    Wednesday 20 May 2026
    China's OSATs chase bigger role as AI chips strain packaging supply

    China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...

    Tuesday 19 May 2026
    Foundry, test costs push PMIC price hikes toward 12-inch wafers
    Rising manufacturing costs at upstream foundries and back-end packaging and testing are pushing power management IC (PMIC) makers toward price increases, with global implications for...
    Tuesday 19 May 2026
    India inaugurates Rajasthan's first semiconductor plant as local chip push expands
    India inaugurated Rajasthan's first semiconductor plant on May 15, marking a significant step in the country's push to expand domestic electronics and chip manufacturing under its...
    Tuesday 19 May 2026
    AEM targets semiconductor and AI markets, begins sampling anti-warpage film and PTFE materials
    Flexible copper clad laminate (FCCL) manufacturer Asia Electric Material (AEM) said that its long-term investment in new product development has begun to yield results, with the company's...
    Monday 18 May 2026
    Swancor and RobiChip partner to bring advanced packaging into robots and drones
    Swancor Holding and RobiChip Technology announced a strategic partnership to accelerate the adoption of advanced packaging materials and heterogeneous chip system integration in robots,...
    1/52 pages
    Research Report Database
    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook