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NEWS TAGGED PACKAGING
Wednesday 3 December 2025
EOC reshapes into integrated supply chain eyeing AI and semiconductors
Optical communication filter maker East Tender Optoelectronics Corp. (EOC) completed a board restructuring in March 2025, positioning itself to capture booming opportunities in AI,...
Wednesday 3 December 2025
Onsemi and Innoscience sign MoU to explore expanded GaN power device production
Onsemi and Innoscience have signed a memorandum of understanding to assess opportunities for expanding the manufacturing of gallium nitride (GaN) power devices, with a focus on accelerating...
Wednesday 3 December 2025
Intel taps Amkor in Korea for advanced chip packaging
Intel is reportedly outsourcing the advanced packaging of its artificial intelligence semiconductors to Amkor Technology Inc.'s facility in Incheon, South Korea, marking the first...
Tuesday 2 December 2025
Intel CEO meets Malaysia PM as Intel puts in additional US$208M investment
Intel CEO Lip-Bu Tan met with Malaysian Prime Minister Anwar Ibrahim on December 1, 2025, where Anwar announced an additional investment of MYR860 million (approx. US$208 million)...
Monday 1 December 2025
Shinkong’s new growth story starts with GPU packaging and e-paper
Shinkong Synthetic Fibers Corporation (SSFC) told investors on November 28 that it is navigating a challenging operating environment marked by raw material price volatility, Chinese...
Monday 1 December 2025
Brightek's Jiangsu plant inaugurated to target smart sensing and AI robotics
Optoelectronic semiconductor integration solution provider Brightek recently officially commissioned its Jiangsu factory, built with an investment of nearly CNY200 million (approx...
Monday 1 December 2025
TSMC reportedly set to take over base-die production in HBM4E generation

Micron said in its latest quarterly results that it will work with TSMC to produce base logic dies for both standard and custom HBM4E...

Friday 28 November 2025
Cheng Mei delivers first CoPoS equipment to ASE
Competing with leading players, Cheng Mei Instrument Technology recently delivered the first CoPoS measurement and inspection equipment to the ASE Group, aiming to break KLA Corporation's...
Thursday 27 November 2025
Contrel eyes 30% semiconductor revenue share by 2026 with PLP, microLED, and TGV
Responding to growing demand in AI and high-performance computing (HPC), Contrel's advanced packaging business is set to expand its revenue share significantly by 2026. Director Tsan-Jen...
Thursday 27 November 2025
FOCI advances 1.6T SiPh for AI servers, eyes mass production
Driven by the AI server market, FOCI is steadily advancing its 1.6T-class silicon photonics (SiPh) products toward mass production. General manager DD Hu announced that sample shipments...
Wednesday 26 November 2025
TEL absent from TSMC annual awards following 2nm leak incident
Tokyo Electron (TEL)—a long-time close partner of TSMC and a frequent awardee—did not appear on the chipmaker's 2025 Excellent Performance Awards list. The absence is...
Wednesday 26 November 2025
Kumamoto pushes for third TSMC plant with packaging, R&D focus
Kumamoto Governor Takashi Kimura visited TSMC's headquarters in Hsinchu on November 24, 2025, as part of a semiconductor investment promotion event in Taipei, saying the chipmaker...
Wednesday 26 November 2025
Global data center AI chip packaging market forecast, 2024-2030
Technological Backbone and Future Platforms
Tuesday 25 November 2025
ASE commits US$133 million to new Taiwan packaging plants to meet AI chip demand
ASE Technology Holding announced it will invest more than NT$4.2 billion (US$133.67 million) to acquire a new factory in the Zhongli District of Taoyuan, Taiwan, and simultaneously...
Tuesday 25 November 2025
ShunSin builds full-stack optical transceiver modules and pilots CSP AI data centers
With the wave of generative AI applications driving rapid upgrades in high-performance computing architectures and data center networks, market demand for ultra-high bandwidth, lower...