In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers...
The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...
Intel executives are expressing growing confidence in the company's long-term outlook, arguing that a fundamental shift in artificial intelligence toward real-world deployment aligns...
Intel reported steady progress on its most advanced manufacturing technologies, saying its 18A process node is seeing meaningful yield improvements, while the next-generation 14A node...
SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that...
TSMC is accelerating its advanced packaging expansion in the US while maintaining a conservative stance on next-generation lithography, as the company balances cost pressures, AI-driven...
Research on optoelectronic integration — referring to the application of optical communication technology to computing — is gaining momentum. Its semiconductor packaging...
Lam Research delivered a strong start to 2026, with first-quarter 2026 results exceeding expectations and reinforcing confidence in a semiconductor upcycle increasingly shaped by artificial...
SK Hynix has broken ground on a large-scale advanced packaging facility in Cheongju Technopolis, underscoring how the battleground for AI semiconductors is shifting beyond wafer fabrication...
Shares of SJSemi surged on their trading debut on Shanghai's SSE STAR Market on Monday, underscoring investor enthusiasm for advanced chip packaging technologies as demand for artificial...
Micron Technology's Sanand assembly, test, marking, and packaging plant has given India something it lacked until recently: a live semiconductor manufacturing operation with global...
Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous...
Glass core substrates, valued for their low dielectric loss and warpage reduction, are key to next-generation advanced semiconductor packaging. In South Korea, traditional glass makers...
AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers...
