Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs....

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...

Tower Semiconductor plans to make Japan its largest manufacturing base for optical communications semiconductors after expanding silicon...

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...