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Friday 26 December 2025
Samsung, SK Hynix reportedly accelerate HBM4 production to early 2026
Samsung Electronics and SK Hynix are pushing forward their production schedules for sixth-generation high-bandwidth memory to February 2026. Industry sources and South Korean media...
Wednesday 24 December 2025
Innolux shifts FOPLP from volume to validation as US client drives orders, plant closures loom
Chairman Jim Hung said Innolux will deprioritize shipment volume for its fan-out panel-level packaging (FOPLP) business in 2026, shifting its focus to redistribution layer (RDL) and...
Wednesday 24 December 2025
Malaysia's semiconductor packaging and testing industry gains momentum with Taiwanese investments
Malaysia's semiconductor packaging and testing sector is experiencing rapid growth driven by Taiwanese and other foreign investments, according to PwC Taiwan. The firm highlights...
Wednesday 24 December 2025
AI chips run too hot: Engineers race to reinvent cooling
The rapid growth of generative AI and large-scale models has significantly increased power consumption in computing chips, pushing thermal management into critical focus. High-end...
Tuesday 23 December 2025
Rohm, Tata Electronics form partnership to manufacture power semiconductors in India
Rohm and Tata Electronics said they have entered into a strategic partnership to establish semiconductor manufacturing operations in India, targeting both domestic and overseas markets,...
Tuesday 23 December 2025
TRI's 2025 operations hit record highs, with advanced packaging opportunities to further drive growth
Optical and electrical inspection equipment supplier Test Research Inc. (TRI) held an online investor conference on December 16, 2025, stating that, benefiting from continued strong...
Monday 22 December 2025
AP Memory sets 2026 mass production timeline for S-SiCap discrete silicon capacitors

AP Memory is expanding into AI servers and high-performance computing, with its S-SiCap roadmap delivering concrete progress. Fourth-generation...

Monday 22 December 2025
Eternal Precision Mechanics commands 95% share of ABF vacuum press market

Eternal Precision Mechanics, a subsidiary of LCY Technology (Eternal Materials), has quietly become one of the most dominant players...

Sunday 21 December 2025
Taiwan academics seek to break through SiPh yield bottlenecks
Cloud computing, GenAI, and high-performance computing continue to drive bandwidth and energy efficiency demands. Line rates have now been pushed beyond 100–200Gbps. The intense...
Friday 19 December 2025
Taiwan makes silicon photonics a pillar of its new national AI strategy

Taiwan is seeking to anchor itself at the center of the next wave of artificial intelligence infrastructure, with silicon photonics elevated...

Friday 19 December 2025
TSMC Co-COO Y.J. Mii wins Executive Yuan Award for driving advanced process and packaging innovation
TSMC Executive Vice President and Co-Chief Operating Officer Y.J. Mii has been awarded the Executive Yuan Award for Outstanding Science and Technology Contribution, underscoring both...
Friday 19 December 2025
Tata Group invests additional US$170M in Tata Electronics to expand iPhone production and semiconductor capacity
Tata Group has invested an additional INR15 billion (US$170 million) in Tata Electronics, the company that manufactures iPhones for Apple, bringing its total investment in the subsidiary...
Friday 19 December 2025
SK Hynix accelerates US$15B M15X expansion as equipment move-in kicks off
SK Hynix is accelerating the build-out of its M15X memory chip plant in Cheongju, South Korea, as the company installs manufacturing tools and moves into the final engineering phase...
Thursday 18 December 2025
Niching targets multi-year vapor chamber upswing, insulates margins against metal costs
Niching Industrial Corp., a supplier of semiconductor packaging and testing materials, said revenue in 2025 is likely to hit a record high, driven by rising cooling demand from AI...
Thursday 18 December 2025
Advanced packaging drives ABF substrate expansion as Taiwanese companies exit post-pandemic capacity cuts
As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers...