Chinese semiconductor equipment makers report record orders extending into 2027, with AI-driven investment in advanced memory, logic chips and packaging strengthening demand for domestic...
China-based optical communications provider Innolight has advanced its next-generation AI optical interconnect strategy. Tower Semiconductor and Innolight said their first jointly...
Optoelectronic chip testing equipment maker EnliTech reported self-assessed consolidated revenue of approximately NT$51.504 million (US$1.57 million) in October 2026, up 71.33% year...
Sumitomo Bakelite reported a 47.2% year-over-year increase in attributable net profit to JPY19.561 billion (US$123 million) for the first half of fiscal 2026, as AI server demand drove...
Japanese electronic components giant Kyocera reported record revenue of JPY1.08 trillion (approximately US$6.83 billion) for the first half of fiscal 2026 (April to September 2026),...
Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth...
FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging...
Taiwan and the Netherlands announced four joint research and development collaborations on November 4 under their bilateral Technology Bridge Program, targeting photonic packaging,...
HCLTech said AI chips will need about 1.5 years to move into mass adoption beyond cloud infrastructure, as the industry develops integrated semiconductor platforms to support large-scale...
MediaTek announced that Navid Shahriari will join the company on November 9 as Senior Vice President, reporting to the General Manager and Chief Operating Officer.
Panasonic Industrial Devices Materials Taiwan's Hukou plant experienced an explosion and fire early on November 4, injuring five employees and leaving two others unaccounted for. The...
South Korea should tie government support for new semiconductor fabs to commitments that benefit domestic chip designers, equipment makers, and packaging suppliers, a state-funded...
China's outsourced semiconductor assembly and test (OSAT) companies entered the fourth quarter with rising sales, high utilization, and an industry-wide price upturn. Their third-quarter...
Competition in the AI application-specific integrated circuit (ASIC) market will extend beyond 2028, industry sources said, with MediaTek, Broadcom, and Marvell competing not only...
Tong Hsing Electronic Industries (THEIL) outlined the latest developments and market trends across its four major product lines of optical communications, ceramic substrates, new semiconductor...
