OSATs and IC test solutions providers are all gearing up for a boom in flip-chip (FC) packaging and high-end testing demand for 5G smartphone application processors (APs) featured...
OSAT ASE Technology has kicked off its recruitment campaign with plans to hire 2,000 engineers by the end of this year to deepen its backend deployments for the 5G, networking and...
As AMD and Nvidia are warming up for rolling out new-generation CPU and GPU processors in first-half 2022, Taiwan-based IC test solutions providers including Chunghwa Precision Test...
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Taiwan's leading cantilever probe card maker MPI has announced it has entered into a definitive agreement to acquire US-based Celadon Systems, which specializes in ultra-high performance...
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec are all expected to post a particularly strong first quarter of 2022, as...
Tape COF substrates and probe cards continue to see robust demand for processing display driver ICs (DDI), which will buoy revenue performance at related suppliers in the third quarter,...
Taiwan-based wafer probing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all seen order visibility extended well into 2022, driven by international...
Flexible PCB specialists Zhen Ding Technology and Flexium Interconnect, reportedly among the suppliers of flexible antenna modules for the upcoming iPhones and other new Apple devices,...
Taiwan's CCL maker Iteq will step up its business diversification, with more efforts on developing high-end CCL materials for handset, IC substrate and flexible mmWave antenna applications,...
Taiwan memory backend specialists are optimistic about their business prospects for the second half of the year as memory demand for handset and other consumer electronics applications...
Taiwan-based flexible PCB specialists Zhen Ding Technology and Flexium Interconnect will both see revenues generated from antenna modules shipments for Apple devices grow substantially...
Hermes Testing Solutions (HTSI), a unit of chipmaking equipment supplier Hermes-Epitek, is poised to develop and manufacture cantilever probe cards with the technology already transferred...
IC test interfaces that can withstand high current of up to 1,000 A and high voltage of 1,200V will see a significant surge in demand for processing high-current driver ICs and other...
