Samsung Electronics Chairman Lee Jae-yong recently met with Vietnamese Prime Minister Pham Minh Chinh, discussing plans to expand investments in Vietnam.

Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...

Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth...

As the smartphone industry enters its peak shipment season in the second half of 2024, major brands are launching new devices. Taiwan's power amplifier (PA) chip supply chains, including...

To concentrate more on its AI chip business, Samsung Electronics has reportedly decided to adjust the development pace of its "Exynos Auto" automotive chip project, which has been...

Samsung Electronics is poised to report impressive results for the second quarter of 2024, driven by a recovery in the semiconductor industry. The company's operating profit surpassed...

Samsung Electronics is reportedly shifting its focus from automotive chip development to AI chips amid plans for significant business reorganization. This strategic pivot comes as...

Arm, the world's largest semiconductor IP company, is reportedly drafting a new blueprint for the AI era.

Vietnam's Prime Minister Pham Minh Chinh recently visited South Korea from June 30 to July 3 to strengthen bilaterial ties and meet with key industry leaders.

In the competitive smartphone market of the second half of 2024, Huawei plans to release its Mate 70 series in the late third quarter.

Samsung Electronics has reportedly established over 40,000 commercial Open RAN sites globally, leveraging...

The largest union at Samsung Electronics Co. said it will stage a three-day walkout beginning July 8, adding to the challenges for South Korea's largest company as it seeks to recover...

Samsung announced progress in its research and development activities in India, emphasizing its commitment to continuing to expand its presence in the country.

Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution...

Samsung Electronics and SK Hynix have conducted immersion cooling technology verification tests on their semiconductors. This move is seen as a response to the emerging next-generation...