News tagged Taiwan at DIGITIMES

NEWS TAGGED TAIWAN

Monday 24 August 2026

iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026

Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor...

Monday 24 August 2026

Taiwan's 'invisible champions' in chip materials are about to become visible, says GlobalWafers' Doris Hsu

Advanced process technology and new device architectures are reshaping the semiconductor supply chain — and the pressure is shifting...

Monday 24 August 2026

AMRA expands robot testing standard to cover legged systems

The Autonomous Mobile Robot Alliance (AMRA), formed by Taiwan's Industrial Technology Research Institute and industry, academia, and research partners, has released a new standard...

Monday 24 August 2026

Taiwan lifts 2027 tech budget, studies new TTA site in BSTP

Taiwan's Executive Yuan approved a larger 2027 technology budget of NT$229.2 billion (approx. US$7.2 billion), an increase of NT$25.9 billion from 2026, as the government also raised...

Monday 24 August 2026

MediaTek wins Google TPU deal on three key strengths

Taiwan's IC design industry is set to keep growing strongly in 2026, with revenue expected to rise 10%, driven mainly by companies involved in AI and AI ASIC projects such as MediaTek,...

Saturday 22 August 2026

Automation Taipei 2026: If AI is advancing so fast, why is the factory floor still so hard to automate?

For all the extraordinary progress made by artificial intelligence, the physical world remains stubbornly difficult to automate.

Saturday 22 August 2026

Column: Lessons in supply chain resilience from China Huadian's power-compute coordination model

As AI develops rapidly, data centers are driving equally rapid growth in electricity demand. The stability of future energy supplies will directly determine whether AI computing capacity...

Friday 21 August 2026

DS Technology shifts from custom automation to modular systems, eyes Brazil and Mexico

Taiwanese automation integrator DS Technology is shifting more of its highly customized robotic automation work toward standardized,...

Friday 21 August 2026

Vecow eyes robotics growth as North America, EMEA account for 65% of business

Taiwan industrial computer supplier Vecow is stepping up its push into robotics and edge AI, with North America and Europe, the Middle East and Africa (EMEA) together accounting for...

Friday 21 August 2026

Hiwin expands into CPO optical coupling process; 2H26 robotics revenue outlook brightens

Hiwin Technologies Chairman Eric Y. T. Chuo stated that the company has supplied samples of miniature ball screws and single-axis robots to co-packaged optics (CPO) vendors across...

Friday 21 August 2026

CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth

Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation...

Friday 21 August 2026

Taiwan automation shifts from hardware specs to AI platforms and open robot architectures

Taiwan's automation industry is moving beyond the traditional race over robot-arm payload, servo precision, and sensor resolution. At the 2026 Automation Taipei and Taiwan Automation...

Friday 21 August 2026

Automation Taipei 2026: German suppliers target aerospace's hidden manufacturing bottlenecks

Aircraft and spacecraft may be judged by thrust, payload capacity, and range, but the German Industry Solutions Session held at Automation Taipei 2026 on August 20 suggested that some...

Friday 21 August 2026

Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's

As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent...

Friday 21 August 2026

FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

1/196 pages

BIZ FOCUS

Aug 20, 11:00

Corning-IRICO Trade Secret Case Enters New Phase

MOST-READ
7 DAYS NEWS

Full list