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Thursday 3 September 2026
CHPT spans wafer to system-level testing
Chunghwa Precision Test Tech showcased a range of test interface solutions for AI chips and high-performance computing (HPC) at SEMICON Taiwan 2026, including AI probe cards, memory...
Thursday 3 September 2026
Niching validates 500-ton press for large heat spreaders
Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said...
Thursday 3 September 2026
Semiconductor sustainability shifts to cost control as fab resource demand surges

Sustainability is not just good for communities and the environment but also good for business. This is the message from a sustainability...

Thursday 3 September 2026
Broadcom says CPO fits scale-out better than scale-up
Broadcom Senior Vice President and General Manager of the Core Switching Group Asad Khamisy said at the Semicon Taiwan 2026 master forum that co-packaged optics (CPO) is not necessarily...
Thursday 3 September 2026
Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue
Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production...
Thursday 3 September 2026
Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...
Thursday 3 September 2026
TSMC doubles down on equipment purchase as AI demand is outpacing semiconductor supply chain planning
TSMC says surging AI demand is stretching the global chip industry beyond its usual planning cycle, with fast-changing procurement needs, labor shortages, and infrastructure constraints...
Thursday 3 September 2026
Taiwan's supply chain is 'one of a kind,' MediaTek CEO says
MediaTek CEO Rick Tsai said Taiwan's supply-chain capabilities are unmatched as the technology industry moves into the AI and robotics era, while joking that the chip designer will...
Thursday 3 September 2026
AUO unit eyes TSMC ecosystem as merger benefits emerge
AUO Group's AET Corporation (AET), formed in September 2025 through the merger of AUO Envirotech and AUO Digitech, is expanding across the semiconductor supply chain and has reportedly...
Thursday 3 September 2026
AI substrate shortages widen as Unimicron signals capacity support through 2029
Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks capacity support for the next three years, during a public...
Thursday 3 September 2026
Google to expand Taipei AI infrastructure center as Taiwan ties deepen
Google will expand its AI infrastructure research and development center in Taipei's Shilin district, adding 60% more office space, as it deepens work with Taiwan's supply chain on...
Thursday 3 September 2026
Lutnick confirms chip tariffs are coming, with relief tied to manufacturing in America
US Commerce Secretary Howard Lutnick has confirmed that the Trump administration is preparing a new round of semiconductor tariffs built around an exemption for companies that manufacture...
Thursday 3 September 2026
CPO material race widens as Taiwan eyes key role
At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan...
Thursday 3 September 2026
Alpha Networks, ITRI develop B5G/Pre-6G Massive MIMO base stations
Network equipment maker Alpha Networks said it has teamed up with Taiwan's Industrial Technology Research Institute (ITRI) and Chen Lung Technology to jointly advance the "B5G/Pre-6G...
Thursday 3 September 2026
LCY Advanced Materials launches wet chemicals for AI chip packaging
LCY Advanced Materials unveiled a new wet chemical solution for next-generation high-density interconnects at the SEMICON Taiwan 2026 Heterogeneous Integration International Summit,...